LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding. Features: High Stiffness,Light-weight Structural,High Heat Resistance,Super Strong (Carbon Fiber Filled),Electrically Conductive,Easy Molding,Structural Information provided by SABIC |