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Master Bond adhesives

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Bi42.5-Pb37.7-Sn11.3-Cd8.5 Bismuth-Lead-Tin-Cadmium Fusible Alloy
Categories: Metal; Nonferrous Metal; Lead Alloy

Material Notes: A noneutectic fusible alloy, low melting temperatureApplications:
  • Anchoring
  • Pattern applications
  • Specialized solder applications

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Physical PropertiesOriginal ValueComments
Specific Gravity 9.44 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 9.0
Tensile Strength 37.0 MPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000400 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Melting Point 70.0 - 90.0 °C
Solidus 71.0 °C
Liquidus 88.0 °C
 
Component Elements PropertiesOriginal ValueComments
Bismuth, Bi 42.5 %
Cadmium, Cd 8.5 %
Lead, Pb 37.7 %
Tin, Sn 11.3 %

References for this datasheet.

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MLBIS936 / 135550

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