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Tra-Con Tra-Bond 968-5 High Dielectric Constant Epoxy Adhesive
Categories:
Polymer
;
Adhesive
;
Thermoset
;
Epoxy
Material Notes:
TRA-BOND 968-5 is a high dielectric constant epoxy adhesive. This one component, electrically insulating epoxy adhesive is designed for chip bonding.
Information provided by Tra-Con Inc.
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Physical Properties
Metric
English
Comments
Viscosity
270000
cP
@Temperature 25.0 °C
270000
cP
@Temperature 77.0 °F
After mixing
Mechanical Properties
Metric
English
Comments
Hardness, Shore D
95
95
Adhesive Bond Strength
17.9
MPa
2600
psi
Lap shear, alum to alum, @ 25°C
Electrical Properties
Metric
English
Comments
Dielectric Constant
10.6
@Frequency 1000 Hz
10.6
@Frequency 1000 Hz
Processing Properties
Metric
English
Comments
Cure Time
60.0
min
@Temperature 150 °C
1.00
hour
@Temperature 302 °F
120
min
@Temperature 125 °C
2.00
hour
@Temperature 257 °F
Working Life
20200
min
@Temperature 25.0 °C
20200
min
@Temperature 77.0 °F
Shelf Life
3.00
Month
3.00
Month
At 5°C
12.0
Month
@Temperature -40.0 °C
12.0
Month
@Temperature -40.0 °F
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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PTRAC212 / 71140
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