| WaferBOND® CR-200 temporary bonding material is produced fop back-end-of-line processing of ultrathin wafers with standard semiconductor equipment. WaferBOND® CR-200 material enables: - Processing of ultrathin wafers using standard lithographic, passivation, and metallization techniques and tooling
- Creation of interconnects before or after thinning
- Preservation of delicate structures on III-V wafers through low-stress demounting
WaferBOND® CR-200 material is used for:- Wafer thinning
- Thinned wafer processing
- Interconnect formation
- Low-stress demounting
WaferBOND® CR-200 properties:- Low-viscosity solution in solvent to provide planarization during spinning
- Spin-applied coatings 10 to 27 µm thick
- Thermal stability to 220ºC in bonded wafer pair state
- Resistance to acids, bases, and most solvents
- Transparent coatings under visible and infrared (IR) light for either optical or IR backside alignment
Information provided by Brewer Science. |
