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Borealis Borstar® HE6069 HDPE
Categories: Polymer; Thermoplastic; Polyethylene (PE); High Density (HDPE)

Material Notes: Borstar HE6069 is a black laser-printable, low-shrinkage, UV-stabilized bimodal high density (HD) jacketing compound, which is produced with the Borealis proprietary Borstar bimodal process technology. Borstar technology allows the manufacturing of polymers outside the traditional MFR and density range making it possible to optimize processability, reduce shrinkage and yet provide excellent physical toughness and environmental stress crack resistance (ESCR). Borstar HE6069 contains a well dispersed UV-stabilizer in sufficient amount providing a measure of weathering resistance.

Applications: Borstar® HE6069 is intended for following applications: Fiber Optical Cables that need to be printed with laser printing technique. Borstar® HE6069 offers substantially reduced shrinkage which helps to maintain low signal attenuation for fiber optic communication cables and low jacket retraction for energy cables in combination with excellent mechanical and barrier properties. Borstar® HE6069 offers a balance of properties giving advantages in manufacturing, installation and lifetime performance of communication and energy cables.

Typical characteristics:

  • Superior processability
  • Very good UV resistance
  • Excellent abrasion & scratch resistance
  • Very low shrinkage
  • Low water permeability
  • Excellent surface hardness
  • Good petroleum-jelly resistance
Specifications: Borstar® HE6069 is expected to meet the applicable requirements included in the below mentioned standards provided it is processed using sound material handling and processing practices as well as appropriate testing procedures. ASTM D1248 Type III, Class A, Category 3, Grade E8, E9, J4; HD 620 S2 Part 1, table 4B, DMP 5, 13, 16, 18; DIN VDE 0818; IEC 60502 Part 2, Type ST7; EN 50290-2-24; IEC 60840 Type ST7; HD 603 S1 DMP 6

Information provided by Borealis AG

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Physical PropertiesOriginal ValueComments
Density 0.944 g/ccISO 1183-1
ESCR 10% Igepal® >= 5000 hour
@Temperature 50.0 °C
IEC 60811-406
Melt Flow 1.70 g/10 min
@Load 2.16 kg,
Temperature 190 °C
ISO 1133-1
Storage Temperature 10.0 - 30.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 61.0
@Time 1.00 sec
ISO 868
Flexural Modulus 800 MPaISO 178
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 10.0 ohm-cmIEC 62631-3
Dielectric Strength >= 20.0 kV/mmIEC 60243
 
Processing PropertiesOriginal ValueComments
Processing Temperature 140 - 180 °CBarrel
Die Temperature 180 °C
Melt Temperature 180 - 200 °C
Shelf Life 24.0 Month
 
Descriptive Properties
Pressure Test at High Temperature (%)<10%115 °C, 6h; IEC 60811-508

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PBORE9676 / 323033

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