Hapco DI-PAK™ R-4528/40 Potting and Encapsulating Compound

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Hapco DI-PAK™ R-4528/40 Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A black, flame retardant, thermally conductive, high performance series that can be used in all types of electrical components. Combined with its ability to dissipate heat, DI-PAK™ R-4528 also provides low linear thermal expansion, low shrinkage, and low exothermic heat while curing. Meets UL requirements. Information provided by Hapco, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.59 g/cc	ASTM D-4669
Viscosity	4250 cP	ASTM D-4878
Linear Mold Shrinkage	0.00050 - 0.0025 in/in	ASTM D-2566

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90	ASTM D-2240
Tensile Strength	5300 psi	ASTM D-638
Elongation at Break	0.14 %	ASTM D-638
Modulus of Elasticity	430 ksi	ASTM D-638
Flexural Strength	6100 psi	ASTM D-790
Flexural Modulus	444 ksi	ASTM D-790
Izod Impact, Notched	0.540 ft-lb/in	ASTM D-256
Izod Impact, Unnotched	0.700 ft-lb/in	ASTM D-256

Electrical Properties	Original Value	Comments
Volume Resistivity	7.20e+13 ohm-cm	ASTM D-270
Dielectric Constant	4.3 @Frequency 100000 Hz	ASTM D-150
	4.6 @Frequency 1000 Hz	ASTM D-150
Dielectric Strength	585 V/mil	ASTM D-149
Dissipation Factor	0.015 @Frequency 100000 Hz	ASTM D-150

Thermal Properties	Original Value	Comments
Thermal Conductivity	2.70 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert	120 °C

Processing Properties	Original Value	Comments
Cure Time	2.00 - 4.00 hour @Thickness 3.17 mm	Demold
Gel Time	35.0 - 45.0 min @Load 0.100 kg	ASTM D-2971

Descriptive Properties
Color (cured)	Glossy Black
Mix Ratio	100:14	Weight
	100:25	Volume

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PHAPCO040 / 317099

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