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Master Bond adhesives

Copper Alloy, UNS C64760, H08 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Spring

Fabrication Properties: Good Suitability – Soldering, Spot Weld, Seam Weld, Capacity for Being Cold Worked, Capacity for Being Hot Formed

Typical Uses: Connectors, Automotive; Connectors, Electrical, Lead-Free; Connectors, electronic; Contact springs; Circuit Breaker Components; Relay Components

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 8.80 g/cc0.318 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Vickers 235
@Load 3.00 kg
235
@Load 6.62 lb
Tensile Strength 779 MPa113000 psiTypical
 738 - 841 MPa107000 - 122000 psi
Tensile Strength, Yield 703 - 800 MPa102000 - 116000 psi0.2% Offset
 752 MPa109000 psi0.2% Offset, Typical
Elongation at Break 1.0 %1.0 %
Tensile Modulus 132 GPa19200 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000430 ohm-cm0.00000430 ohm-cm40% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.6 µm/m-°C
@Temperature 20.0 - 300 °C
9.80 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 14.1 W/m-K98.0 BTU-in/hr-ft²-°F
Melting Point >= 1075 °C>= 1967 °F
Solidus 1075 °C1967 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 94.4 - 97.8 %94.4 - 97.8 %As Balance
Iron, Fe <= 0.10 %<= 0.10 %
Lead, Pb <= 0.050 %<= 0.050 %
Magnesium, Mg <= 0.30 %<= 0.30 %
Manganese, Mn <= 0.10 %<= 0.10 %
Nickel, Ni 1.5 - 3.0 %1.5 - 3.0 %
Silicon, Si 0.40 - 0.80 %0.40 - 0.80 %
Tin, Sn 0.050 - 0.50 %0.050 - 0.50 %
Zinc, Zn 0.30 - 0.80 %0.30 - 0.80 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC64760x6 / 292245

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