EP2 Enhanced Polyimide is the next generation of polyimide and prepreg products, engineered for improved properties and processing and for applications requiring optimum thermal performance. EP2 is a filled product, yet with significantly improved copper adhesion compared to traditional polyimides. Reduced water absorption, higher thermal conductivity and reduced CTE are all achieved while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduced cure cycle compared to traditional polyimides offers reduced process times throughout.

• Lower electrical loss results in improved signal integrity
• Toughened, non-MDA chemistry resists drill fracturing
• Fully compatible with lead-free solder processing

Typical Applications:

• PCBs that are subjected to high temperatures during processing and rework, such as lead-free soldering. Reduced risk of latent PTH damage due to low Z-direction CTE
• Applications with significant service life expectations at high temperatures, such as aircraft engine instrumentation, on-engine applications, down-hole drilling and industrial sensor packages, under-hood automotive controls and burn-in testing of ICs (Burn-in-Boards)

Information provided by ARLON Electronic Materials.

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