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Ensinger PEI

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Parker Chomerics CHO-FLEX 601 Conductive Coating
Categories: Polymer; Thermoset; Polyurethane, TS

Material Notes: CHO-FLEX™ 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adhesion and flexibility, thermal stability, high conductivity, and superior peel strength. CHO-FLEX™ 601 coating can be sprayed or silkscreened, and will withstand wave solder temperatures above 500°F (260°C) without losing any of its exceptional properties

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Density 1.67 g/cc
Solids Content 58 %
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.00015 ohm-cm
@Thickness 0.0254 mm
film
Surface Resistivity per Square <= 0.050 ohm
@Thickness 0.0254 mm
film
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air >= 107 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 0.0500 hour
@Temperature 260 °C
Wave Solder
 1.50 hour
@Temperature 182 °C
 5.00 hour
@Temperature 163 °C
Initial Cure
 90.0 hour
@Temperature 182 °C
Press Cycle
Shelf Life 6.00 Month
 
Descriptive Properties
Adhesion5BASTM D3359-78
BinderPolyurethane
ConsistencyThixotropic Paste
FillerAg
ResinPolyurethane
Theoretical Coverage4320 in2 / lbActual coverage will be 50-100%

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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