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3M Scotch-Weld™ DP190 Gray Epoxy Adhesive
Categories:
Polymer
;
Adhesive
;
Thermoset
;
Epoxy
;
Epoxy Adhesive
Material Notes:
3M™ Scotch-Weld™ Epoxy Adhesive DP190 Gray is a 1:1 mix ratio similar to Scotch-Weld™ Epoxy Adhesive 2216 B/A Gray and exhibits good peel, shear and environmental aging properties.
Information provided by 3M
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Physical Properties
Metric
English
Comments
Brookfield Viscosity
40000
-
80000
cP
40000
-
80000
cP
Accelerator, RFV #7 at 20 rpm
75000
-
150000
cP
75000
-
150000
cP
Base, RFV #7 at 20 rpm
Mechanical Properties
Metric
English
Comments
Hardness, Shore D
60
60
ASTM D2240
Tensile Strength at Break
24.1
MPa
3500
psi
ASTM D882
Elongation at Break
30 %
30 %
ASTM D882
Shear Strength
0.345
MPa
50.0
psi
Overlap, Polypropylene
2.07
MPa
300
psi
Overlap, Glass, Borosilicate
2.07
MPa
300
psi
Overlap, Glass, +3M Scotch-Weld Primer 3901
3.45
MPa
500
psi
Overlap, Acrylic
4.83
MPa
700
psi
Overlap, ABS
5.52
MPa
800
psi
Overlap, Polycarbonate
5.52
MPa
800
psi
Overlap, PVC
7.58
MPa
1100
psi
Overlap, Wood, Fir
9.65
MPa
1400
psi
Overlap, CRS
10.3
MPa
1500
psi
Overlap, Sanded Aluminum
11.0
MPa
1600
psi
Overlap, Fiberglass
17.2
MPa
2500
psi
Overlap, Etched Aluminum
2.76
MPa
@Temperature 82.0 °C
400
psi
@Temperature 180 °F
Overlap
4.14
MPa
@Temperature 66.0 °C
600
psi
@Temperature 151 °F
Overlap
6.89
MPa
@Temperature 49.0 °C
1000
psi
@Temperature 120 °F
Overlap
10.3
MPa
@Temperature -55.0 °C
1500
psi
@Temperature -67.0 °F
Overlap
17.2
MPa
@Temperature 21.0 °C
2500
psi
@Temperature 69.8 °F
Overlap
Peel Strength
0.351
kN/m
@Temperature 82.0 °C
2.00
pli
@Temperature 180 °F
180°
0.526
kN/m
@Temperature -55.0 °C
3.00
pli
@Temperature -67.0 °F
180°
0.701
kN/m
@Temperature 66.0 °C
4.00
pli
@Temperature 151 °F
180°
1.75
kN/m
@Temperature 49.0 °C
10.0
pli
@Temperature 120 °F
180°
3.51
kN/m
@Temperature 21.0 °C
20.0
pli
@Temperature 69.8 °F
180°
Electrical Properties
Metric
English
Comments
Volume Resistivity
5.00e+12
ohm-cm
5.00e+12
ohm-cm
ASTM D257
Dielectric Constant
6.5
@Frequency 1000 Hz
6.5
@Frequency 1000 Hz
ASTM D150
Dielectric Strength
32.7
kV/mm
@Thickness 0.762 mm
830
kV/in
@Thickness 0.0300 in
ASTM D149
Dissipation Factor
0.090
@Frequency 1000 Hz
0.090
@Frequency 1000 Hz
ASTM D150
Thermal Properties
Metric
English
Comments
CTE, linear
62.0
µm/m-°C
@Temperature 5.00 - 25.0 °C
34.4
µin/in-°F
@Temperature 41.0 - 77.0 °F
Below Tg
177
µm/m-°C
@Temperature 65.0 - 140 °C
98.3
µin/in-°F
@Temperature 149 - 284 °F
Above Tg
Thermal Conductivity
0.381
W/m-K
@Thickness 6.35 mm,
Temperature 43.3 °C
2.64
BTU-in/hr-ft²-°F
@Thickness 0.250 in,
Temperature 110 °F
Glass Transition Temp, Tg
7.00
°C
44.6
°F
Onset
20.0
°C
68.0
°F
Mid-Point
Processing Properties
Metric
English
Comments
Cure Time
480
-
720
min
8.00
-
12.0
hour
Time to Handling Strength
10100
min
168
hour
Full Cure
Tack-Free Time
360
min
6.00
hour
Descriptive Properties
Appearance
Gray
Accelerator
Gray
White
Base
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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