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Master Bond adhesives

3M Scotch-Weld™ DP190 Gray Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: 3M™ Scotch-Weld™ Epoxy Adhesive DP190 Gray is a 1:1 mix ratio similar to Scotch-Weld™ Epoxy Adhesive 2216 B/A Gray and exhibits good peel, shear and environmental aging properties.

Information provided by 3M

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Physical PropertiesMetricEnglishComments
Brookfield Viscosity 40000 - 80000 cP40000 - 80000 cPAccelerator, RFV #7 at 20 rpm
 75000 - 150000 cP75000 - 150000 cPBase, RFV #7 at 20 rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6060ASTM D2240
Tensile Strength at Break 24.1 MPa3500 psiASTM D882
Elongation at Break 30 %30 %ASTM D882
Shear Strength 0.345 MPa50.0 psiOverlap, Polypropylene
 2.07 MPa300 psiOverlap, Glass, Borosilicate
 2.07 MPa300 psiOverlap, Glass, +3M Scotch-Weld Primer 3901
 3.45 MPa500 psiOverlap, Acrylic
 4.83 MPa700 psiOverlap, ABS
 5.52 MPa800 psiOverlap, Polycarbonate
 5.52 MPa800 psiOverlap, PVC
 7.58 MPa1100 psiOverlap, Wood, Fir
 9.65 MPa1400 psiOverlap, CRS
 10.3 MPa1500 psiOverlap, Sanded Aluminum
 11.0 MPa1600 psiOverlap, Fiberglass
 17.2 MPa2500 psiOverlap, Etched Aluminum
 2.76 MPa
@Temperature 82.0 °C
400 psi
@Temperature 180 °F
Overlap
 4.14 MPa
@Temperature 66.0 °C
600 psi
@Temperature 151 °F
Overlap
 6.89 MPa
@Temperature 49.0 °C
1000 psi
@Temperature 120 °F
Overlap
 10.3 MPa
@Temperature -55.0 °C
1500 psi
@Temperature -67.0 °F
Overlap
 17.2 MPa
@Temperature 21.0 °C
2500 psi
@Temperature 69.8 °F
Overlap
Peel Strength  0.351 kN/m
@Temperature 82.0 °C
2.00 pli
@Temperature 180 °F
180°
 0.526 kN/m
@Temperature -55.0 °C
3.00 pli
@Temperature -67.0 °F
180°
 0.701 kN/m
@Temperature 66.0 °C
4.00 pli
@Temperature 151 °F
180°
 1.75 kN/m
@Temperature 49.0 °C
10.0 pli
@Temperature 120 °F
180°
 3.51 kN/m
@Temperature 21.0 °C
20.0 pli
@Temperature 69.8 °F
180°
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.00e+12 ohm-cm5.00e+12 ohm-cmASTM D257
Dielectric Constant 6.5
@Frequency 1000 Hz
6.5
@Frequency 1000 Hz
ASTM D150
Dielectric Strength 32.7 kV/mm
@Thickness 0.762 mm
830 kV/in
@Thickness 0.0300 in
ASTM D149
Dissipation Factor 0.090
@Frequency 1000 Hz
0.090
@Frequency 1000 Hz
ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  62.0 µm/m-°C
@Temperature 5.00 - 25.0 °C
34.4 µin/in-°F
@Temperature 41.0 - 77.0 °F
Below Tg
 177 µm/m-°C
@Temperature 65.0 - 140 °C
98.3 µin/in-°F
@Temperature 149 - 284 °F
Above Tg
Thermal Conductivity 0.381 W/m-K
@Thickness 6.35 mm,
Temperature 43.3 °C
2.64 BTU-in/hr-ft²-°F
@Thickness 0.250 in,
Temperature 110 °F
Glass Transition Temp, Tg 7.00 °C44.6 °FOnset
 20.0 °C68.0 °FMid-Point
 
Processing PropertiesMetricEnglishComments
Cure Time 480 - 720 min8.00 - 12.0 hourTime to Handling Strength
 10100 min168 hourFull Cure
Tack-Free Time 360 min6.00 hour
 
Descriptive Properties
AppearanceGrayAccelerator
 Gray
 WhiteBase

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