MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

(Viewing data as-entered. Click here to return)
Lord Adhesives CoolTherm™ EP-6008 BLK/6010 Epoxy System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: LORD CoolTherm™ EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

Features: protects components from moisture and vibrations. self-leveling liquid maintains low viscosity for ease of component encapsulation. exhibits low shrinkage and stress on components as it cures. can be used on parts and devices that experience operating temperatures from -55°C to +155°C.

All information provided by Lord.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 0.920 g/ccEP-6010 Hardener
 1.55 g/cc
@Temperature 25.0 °C		EP-6008 BLK Resin
Water Absorption 0.35 %
@Temperature 25.0 °C,
Time 864000 sec		cured
Viscosity 55 cP
@Temperature 25.0 °C		EP-6010 Hardener
 8000 cP
@Temperature 25.0 °C		EP-6008 BLK Resin
Linear Mold Shrinkage 0.0040 in/incured
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85cured
Tensile Strength 7200 psi
@Temperature 25.0 °C		cured
Elongation at Break 1.8 %cured
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+14 ohm-cm
@Temperature 25.0 °C		cured
Dielectric Constant 4.0
@Temperature 25.0 °C		cured
Dielectric Strength 450 V/milcured
Dissipation Factor 0.020
@Temperature 25.0 °C		cured
 
Thermal PropertiesOriginal ValueComments
CTE, linear 40.0 µm/m-°Ccured
Thermal Conductivity 0.300 W/m-Kcured
Maximum Service Temperature, Air 155 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour
@Temperature 65.0 °C
 12.0 hour
@Temperature 25.0 °C
Working Life 60.0 min
@Temperature 25.0 °C		Mixed
Shelf Life 12.0 Month
@Temperature 25.0 °C		EP-6008 BLK Resin, from date of manufacture when stored in original, unopened container
 24.0 Month
@Temperature 25.0 °C		EP-6010 Hardener, from date of manufacture when stored in original, unopened container
 
Descriptive Properties
AppearanceAmber LiquidEP-6010 Hardener
 Black LiquidEP-6008 BLK Resin
Mix Ratio100 to 7Resin to hardener, by weight

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Henkel Loctite® PRISM® 401 Instant Adhesive

PLORD9259 / 232615




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.