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Parker Chomerics CHO-BOND® 1072 Conductive Silicone Splicing Compound
Categories:
Polymer
;
Adhesive
;
Thermoset
;
Silicone
Material Notes:
Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silicone binder.
Information provided by Chomerics
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Physical Properties
Original Value
Comments
Density
2.00
g/cc
Thermal Properties
Original Value
Comments
Maximum Service Temperature, Air
160
°C
Minimum Service Temperature, Air
-55.0
°C
Processing Properties
Original Value
Comments
Pot Life
30
min
@Temperature 24.0 °C
20160
min
@Temperature -35.0 °C
Shelf Life
6.00
Month
For parts A & B
Descriptive Properties
Part A/B/C %
23.3/2.3/74.4
Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's
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Users viewing this material also viewed the following:
Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad
Parker Chomerics CHO-FORM 5519 Conductive Silicone
Parker Chomerics CHO-BOND® 1076, Part A Silicone
Parker Chomerics CHO-BOND® 1056, Part B Silicone Resin Mixture
Parker Chomerics CHO-BOND® 1053, Part C Silicone Rubber
PCHOME016 / 28238
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