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Elmet Technologies

Celanese Hostaform® WR140LG POM, UV Resistant
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM)

Material Notes: Hostaform« acetal copolymer grade WR140LG Black is a specialty weatherable grade of acetal copolymer formulated to provide good flow with a low gloss finish and a UV stability necessary for exterior automotive applications.

Information provided by Celanese

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Physical PropertiesMetricEnglishComments
Density 1.33 g/cc0.0480 lb/in³ISO 1183
Linear Mold Shrinkage, Flow 0.016 cm/cm0.016 in/inISO 294-4
Linear Mold Shrinkage, Transverse 0.015 cm/cm0.015 in/inISO 294-4
Melt Flow 13 g/10 min
@Load 2.16 kg,
Temperature 190 °C
13 g/10 min
@Load 4.76 lb,
Temperature 374 °F
[cm3/10min]; ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 41.0 MPa5950 psi50mm/min; ISO 527-2/1A
Elongation at Yield 10 %10 %50mm/min; ISO 527-2/1A
Tensile Modulus 1.80 GPa261 ksi50mm/min; ISO 527-2/1A
Flexural Modulus 1.85 GPa268 ksiISO 178
Charpy Impact, Notched 0.360 J/cm²1.71 ft-lb/in²ISO 179/1eA
 0.360 J/cm²
@Temperature -30.0 °C
1.71 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eA
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 130 µm/m-°C72.2 µin/in-°FISO 11359-2
CTE, linear, Transverse to Flow 130 µm/m-°C72.2 µin/in-°FISO 11359-2
Melting Point 165 °C329 °F10°C/min; ISO 11357-1,-2,-3
Deflection Temperature at 1.8 MPa (264 psi) 80.0 °C176 °FISO 75-1, -2
 
Processing PropertiesMetricEnglishComments
Processing Temperature 80.0 - 105 °C176 - 221 °Fcavity
 180 - 200 °C356 - 392 °Fhot runner
Zone 1 170 - 175 °C338 - 347 °F
Zone 2 170 - 180 °C338 - 356 °F
Zone 3 175 - 185 °C347 - 365 °F
Zone 4 180 - 190 °C356 - 374 °F
Die Temperature 185 - 195 °C365 - 383 °F
Melt Temperature 180 - 195 °C356 - 383 °F
Drying Temperature 105 - 110 °C221 - 230 °F
Dry Time 3.00 hour3.00 hour
Injection Pressure 60.0 - 120 MPa8700 - 17400 psi
Hold Pressure 60.0 - 120 MPa8700 - 17400 psi
Back Pressure <= 4.00 MPa<= 580 psi
 
Descriptive Properties
Injection moldingYes
Injection speedslow
Processing conditions acc. ISO9988-2

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PHCQ433 / 178888

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