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Chemically Resistant adhesives

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Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive epoxy systems, the EP21TDCN has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1800 psi tensile shear and a T-peel of greater than 20 pli when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is 5-10 ohm-cm. Master Bond Polymer System EP21TDCN can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, toluene, etc.) by weight. The high strength bonds respond well to thermal cycling and are resistant to chemicals including water, oil and most organic solvents. EP21TDCN has a service temperature range of -100°F to more than +275°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored nickel. Master Bond EP21TDCN adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive applications. For convenient handling, EP21TDCN is now available in premixed and frozen syringes.

Product Advantages:

  • Convenient mixing: 1 to 1 by weight or volume
  • Contains no volatiles; excellent low outgassing properties
  • Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly.
  • Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
  • Good electrical conductivity.
  • High bond strength to similar and dissimilar substrates.
  • Superior durability, thermal shock and chemical resistance.
  • Outstanding toughness; much less rigid than conventional nickel epoxy

Information provided by MasterBond®

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Mechanical PropertiesOriginal ValueComments
Shear Strength >= 1800 psiafter 30 days water immersion, Al/Al, Bond
 >= 1850 psiAl/Al, Bond
Peel Strength >= 20.0 pliT-peel
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 5.0 - 10 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 275 °F
Minimum Service Temperature, Air -100 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 36.0 - 48.0 hour90% of maximum strength developed within
Pot Life 60 - 75 min200 gram mass
 75 - 90 min100 gram mass
Shelf Life 3.00 - 6.00 Month
@Temperature 23.9 °C
in unopened containers
 
Descriptive Properties
Mixing Ratio (A to B)1/1by weight or volume

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PMASTB325 / 149572

Chemically Resistant adhesives

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