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Master Bond adhesives

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Plenco 6554 Phenolic, Granular, Compression Molded  (discontinued **)
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic; Phenolic, Novolac, Flock Filled

Material Notes: Two-Stage Phenolic. PLENCO 06554 is an organic reinforced phenolic molding compound modified with PTFE to offer improved coefficient of friction values. 06554 is available in black.

Information supplied by Plenco

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Physical PropertiesOriginal ValueComments
Density 1.43 g/ccASTM D792
Apparent Bulk Density 0.580 g/ccApparent density per ASTM D1895
Water Absorption 0.45 %ASTM D570
Linear Mold Shrinkage 0.0044 cm/cmper ATM D955. Post shrinkage is 0.14% at 72hr 120ºC per ASTM D1299.
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell E 75ASTM D785
Tensile Strength, Ultimate 55.7 MPaASTM D638
Elongation at Break 0.89 %ASTM D638
Tensile Modulus 8.27 GPaASTM D638
Flexural Yield Strength 83.2 MPaASTM D790
Flexural Modulus 7.72 GPaASTM D790
Compressive Yield Strength 155.3 MPaASTM D695
Izod Impact, Notched 0.230 J/cmASTM D256
Charpy Impact, Notched 0.220 J/cm²ASTM D256
Impact 150J/m Plenco drop ball test
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 2.128e+12 ohm-cmASTM D257
Dielectric Constant 4.5
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 16.2 kV/mmShort Time; ASTM D149
Dissipation Factor 0.040
@Frequency 1e+6 Hz
ASTM D150
Arc Resistance 60 secASTM D495
Comparative Tracking Index 175 VASTM D3638
 
Thermal PropertiesOriginal ValueComments
CTE, linear 99.0 µm/m-°C
@Temperature 20.0 °C
Thermal Conductivity 0.370 W/m-K
@Temperature 100 °C
Maximum Service Temperature, Air 190 °CHeat resistance per ASTM D794
Deflection Temperature at 1.8 MPa (264 psi) 160 °CASTM D648
Flammability, UL94 HB
@Thickness 1.50 mm

**
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