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Rulon Bearings

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Lord Adhesives Thermoset™ ME-455 Epoxy Board Level Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-455 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices.

Thermoset ME-455 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications.

All information provided by Lord.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.69 g/cc
Brookfield Viscosity 14000 - 24000 cPSpindle 14 @ 10rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 91 - 98
Modulus of Elasticity 6.00 GPaDMA
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cm
@Temperature 25.0 °C
Dielectric Constant 3.5
@Frequency 1e+6 Hz
Dissipation Factor 0.0080
@Frequency 1e+6 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 19.0 µm/m-°CAlpha 1; TMA
 60.0 µm/m-°CAlpha 2; TMA
Glass Transition Temp, Tg 135 °CTMA
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 150 °C
Pot Life 2160 min
@Temperature 25.0 °C
Gel Time 3.00 - 5.00 min
@Temperature 150 °C
Shelf Life 6.00 Month
@Temperature -40.0 °C
 
Component Elements PropertiesOriginal ValueComments
Potassium, K 0.00010 %
Sodium, Na 0.00050 %
 
Descriptive Properties
AppearanceBlack
Chloride (%)0.0005
ConsistencyPaste

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PLORD090 / 86098

Aluminum Castings

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