Epoxy Technology EPO-TEK® T905BN-3 Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® T905BN-3 Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Advantages & Application Notes: Potting applications: Low viscosity, self leveling epoxy is ideal for potting applications Low exothermic chemistry is ideal for large volume casting or potting – up to 10 liters can be realized Reasonable pot-life allows for repeated cycles of vacuum and pressure, yielding bubble free epoxy and potted elements High thermal conductivity allows for adhesive bonding of heat sinks and metal cases Suggested applications: Hybrids: staking and globbing high power SMDs to ceramic PCB Medical: cooling of ultrasound and x-ray circuits, via adhesive and potting Optical: thermally enhanced laser diode packaging Electronics: encapsulating inductors, Cu coils and SMDs in transformer casings After cure, it is capable of being machined, grinded and polished into desired shapes A grey color with a unique granular-like appearance. It should not be used above delicate Au wire bonds, resulting in sweep or break. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	0.960 g/cc	Part B
	1.65 g/cc	Part A
Particle Size	<= 300 µm
Viscosity	2000 - 7000 cP @Temperature 23.0 °C	50 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	60
Tensile Modulus	721520 psi	Storage
Shear Strength	>= 1600 psi	Lap
	>= 3400 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	3.00e+11 ohm-cm
Dielectric Constant	3.51 @Frequency 1000 Hz
Dissipation Factor	0.0090 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	37.0 µm/m-°C	Below Tg
	151 µm/m-°C	Above Tg
Thermal Conductivity	2.02 W/m-K
Maximum Service Temperature, Air	200 °C	Continuous
	300 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 40.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	347 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	2.00 hour @Temperature 80.0 °C	Minimum Bond Line
Pot Life	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Clear	Part B
	Gary	Part A
Consistency	Granular paste
Mix Ratio by Weight	100:14
Number of Components	Two
Thixotropic Index	1.53
Weight Loss	<0.05%	200°C
	0.16%	250°C
	1%	300°C

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PPOXYT099 / 141138

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