| Temporary wafer bonding release material for mechanical debonding applications. BrewerBOND® 510 material is applied to a carrier using a simple process and is compatible with =300°C bonding materials. After processing, a low-force separation method is used to debond, and the carrier could potentially be reused. Because the carrier may be reused (depending on metallization processes), this material has a lower cost of ownership than other options, making it ideal for entry into the wafer-bonding space or for projects with smaller throughput requirements. Key Market Sectors include 3-D wafer-level packaging, MEMS, and Compound semiconductor. Benefits include Compatible with 250°C - 300°C bonding materials; Simple application on carrier; Lower cost of ownership with carrier reuse; Carrier rework by RCA clean or ash; and Low-force separation. Information provided by Brewer Science. |
