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Master Bond adhesives

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CP-Polymer-Technik Wellamid® 6000 HWCP Nylon 6, Heat Stabilized, Dry
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6); Nylon 6, Unreinforced

Material Notes: Information provided by CP-Polymer-Technik GmbH & Co. KG

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Physical PropertiesOriginal ValueComments
Density 1.13 g/ccISO 1183
Moisture Absorption at Equilibrium 2.5 - 3.3 %23°C/50%RH; DIN 53495
Linear Mold Shrinkage 0.0080 - 0.012 cm/cm
@Thickness 4.00 mm
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 88.0 MPa50 mm/min; ISO 527
Elongation at Break 15 %50 mm/min; ISO 527
Elongation at Yield 4.0 %50 mm/min; ISO 527
Tensile Modulus 3.00 GPaISO 527
Flexural Modulus 2.50 GPaDIN 52457
Charpy Impact Unnotched NB
@Temperature 23.0 °C
ISO 179
Charpy Impact, Notched 0.700 J/cm²
@Temperature 23.0 °C
ISO 179
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmIEC 93
Surface Resistance 1.00e+13 ohmISO 3915
Dielectric Constant 3.5
@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 30.0 kV/mmIEC 243-1
Dielectric Loss Index 0.020
@Frequency 1e+6 Hz
IEC 250
Comparative Tracking Index 600 VStufe; IEC 112
 
Thermal PropertiesOriginal ValueComments
CTE, linear 85.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
DIN 53752
Melting Point 215 °CKofler
Deflection Temperature at 0.46 MPa (66 psi) 170 °CISO 179
Deflection Temperature at 1.8 MPa (264 psi) 65.0 °CISO 179
Vicat Softening Point 200 °C50 N; ISO 306
Flammability, UL94 V-2
@Thickness 1.60 mm
Stufe; IEC 707
 V-2
@Thickness 3.20 mm
Stufe; IEC 707
 
Processing PropertiesOriginal ValueComments
Melt Temperature 245 - 265 °C
Mold Temperature 40.0 - 80.0 °C
 
Descriptive Properties
Back PressureLow
Holding PressureHigh
Injection SpeedMedium to High
Screw SpeedHigh

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