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Master Bond adhesives

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Copper, UNS C19700, H02 Temper
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Excellent soldering and brazing. Excellent capacity for both cold and hot forming.

Applications: Electrical and electronic connectors, circuit breaker components, fuse clips, cable shielding, and lead frames. Generally suited to applications requiring excellent formability combined with high strength and conductivity.

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Physical PropertiesOriginal ValueComments
Density 8.83 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 68
Tensile Strength, Ultimate 380 MPa
Tensile Strength, Yield 315 MPaStrip
Elongation at Break 10 %In 50 mm
Modulus of Elasticity 121 GPa
Machinability 20 %UNS C36000 (free-cutting brass) = 100%
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000216 ohm-cm
@Temperature 20.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 15.8 µm/m-°C
@Temperature 20.0 - 100 °C
 16.8 µm/m-°C
@Temperature 20.0 - 200 °C
 17.3 µm/m-°C
@Temperature 20.0 - 300 °C
Thermal Conductivity 320 W/m-K
Melting Point 1069 - 1086 °C
Solidus 1069 °C
Liquidus 1086 °C
 
Processing PropertiesOriginal ValueComments
Annealing Temperature 450 - 600 °C
Hot-Working Temperature 750 - 950 °C
 
Component Elements PropertiesOriginal ValueComments
Cobalt, Co <= 0.050 %
Copper, Cu 99.15 %
Iron, Fe 0.30 - 1.2 %
Lead, Pb <= 0.050 %
Magnesium, Mg 0.010 - 0.20 %
Manganese, Mn <= 0.050 %
Phosphorus, P 0.10 - 0.40 %
Tin, Sn <= 0.20 %
Zinc, Zn <= 0.20 %

References for this datasheet.

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MC19700b1 / 10974

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