Parker Chomerics CHO-BOND® 1029 Conductive Adhesive

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Parker Chomerics CHO-BOND® 1029 Conductive Adhesive
Categories:	Polymer; Adhesive; Thermoset; Silicone
Material Notes:	CHO-BOND® 1029 is a highly conductive silicone adhesive, intended for bonding Chomerics’ conductive silicone EMI gaskets to electrically conductive substrates. It is a two-component, siliver-plated-copper filled system which cures to a flexible, permanent bond. Unlike 1-part conductive silicone RTV adhesives, its cure can be accelerated with heat. CHO-BOND® 1029 should not be used as an EMI caulk. The material is highly conductive through a bond line of less than 8 mils, but through a bond line of greater thickness, CHO-BOND 1029 electrical conductivity sharply decreases. Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Specific Gravity	2.65 - 3.35 g/cc	2.65 - 3.35 g/cc
Thickness	203 microns	8.00 mil

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 3.10 MPa	>= 450 psi	Lap

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.060 ohm-cm	<= 0.060 ohm-cm	DC resistance in ohms through a 2.58 cm² by 0.02 cm thick sample

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 121 °C	0.500 hour @Temperature 250 °F
	10100 min @Temperature 24.0 °C	168 hour @Temperature 75.2 °F
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties
Binder	Silicone
Consistency	Thick paste
Coverage	25.5 cm² / g
Filler	Ag/Cu
Mix Ratio	1.0:2.5
Working Life	2 hrs

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PCHOME017 / 28239

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