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Metal adhesives

Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • Room temperature curing
  • Low viscosity
  • Low shrinkage upon cure
  • Passes NASA low outgassing test
  • Very low coefficient of expansion
  • Superior dimensional stability
Product Description: Master Bond EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) along with meeting NASA low outgassing specifications. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. To optimize the properties, it is recommended to cure at room temperature for 12-24 hours, followed by a post cure of a few hours at 150-200°F. The CTE is in the range of 15-18 x 10-6 in/in/°C; markedly lower than other systems. Additionally, it has very good thermal conductivity and is highly electrically insulative. EP30LTELO is also noteworthy for its superior dimensional stability. Its linear shrinkage upon curing is exceptionally low, less than 0.01%. EP30LTE-LO bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of 4K to +250°F enabling it to be using in cryogenic conditions. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE-LO is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with low outgassing is desirable.

Product Advantages:

  • 100% reactive, contains no diluents or solvents
  • Very low shrinkage upon cure
  • Lower viscosity; good flow properties—ideal for small to moderate sized castings
  • Exceptionally low thermal expansion coefficient: about 15-18 x 10-6 in/in/°C
  • Good thermal conductivity while still electrically insulative
  • Superior dimensional stability
  • Passes NASA low outgassing tests

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Viscosity 290 - 500 cP290 - 500 cPPart B
 35000 - 70000 cP35000 - 70000 cPPart A
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D >= 85>= 85
Tensile Strength >= 41.4 MPa>= 6000 psi
Adhesive Bond Strength >= 11.0 MPa>= 1600 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cm
Dielectric Constant 4.1
@Frequency 60 Hz
4.1
@Frequency 60 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 15.0 - 18.0 µm/m-°C8.33 - 10.0 µin/in-°F
Thermal Conductivity 1.1538 - 1.4423 W/m-K8.0074 - 10.010 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C250 °F
Minimum Service Temperature, Air -167 °C-269 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 2880 - 4320 min
@Temperature 23.9 °C
48.0 - 72.0 hour
@Temperature 75.0 °F
Working Life 45.0 - 75.0 min45.0 - 75.0 minAfter mixing, 100 g batch
Shelf Life 3.00 - 6.00 Month
@Temperature <=23.9 °C
3.00 - 6.00 Month
@Temperature <=75.0 °F
in original, unopened containers
 
Descriptive Properties
Mixing Ratio10:1 by weightParts A to B

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PMASTM864 / 185457

Metal adhesives

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