Epoxy Technology EPO-TEK® H74F Thermally Conductive, Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® H74F Thermally Conductive, Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Material Description: A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic feed-through. It may be considered a finer particle version of EPO-TEK® H74. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	1.02 g/cc	1.02 g/cc	Part B
	2.02 g/cc	2.02 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	45000 - 75000 cP @Temperature 23.0 °C	45000 - 75000 cP @Temperature 73.4 °F	5 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Na (Sodium)	20 ppm	20 ppm
Ionic Impurities - K (Potassium)	9.0 ppm	9.0 ppm
Ionic Impurities - Cl (Chloride)	41 ppm	41 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	88	88
Tensile Modulus	4.40 GPa	638 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 35.2 MPa	>= 5100 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 5.00e+13 ohm-cm	>= 5.00e+13 ohm-cm
Dielectric Constant	4.9 @Frequency 1000 Hz	4.9 @Frequency 1000 Hz
Dissipation Factor	0.012 @Frequency 1000 Hz	0.012 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	33.0 µm/m-°C	18.3 µin/in-°F	Below Tg
	108 µm/m-°C	60.0 µin/in-°F	Above Tg
Thermal Conductivity	0.520 W/m-K	3.61 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	486 °C	907 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum
	10.0 min @Temperature 120 °C	0.167 hour @Temperature 248 °F	Minimum
	20.0 min @Temperature 100 °C	0.333 hour @Temperature 212 °F	Minimum
Pot Life	180 min	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Amber		Part B
	Dark Gray		Part A
Consistency	Smooth paste
Ionic Impurities NH₄	100 ppm
Mix Ratio by Weight	100:4
Number of Components	Two
Thixotropic Index	1.9
Weight Loss	0.05%		200°C
	0.05%		250°C
	0.1%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT082 / 141121

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