| PRETHERM TPE 1050 is a thermoplastic elastomer based highly thermally conductive compound intended primarily for heat dissipation. It is used as gap filler between processor and heat sink or co-molded into plastic shell. Thermal conductivity is achieved with Boron nitride which is highly thermally conductive and electrically isolating. PRETHERM TPE 1050 can be injection-molded like an ordinary thermoplastic elastomer. It has adhesion to selected thermoplastics and metal contacts are also arranged. It can be used in co-injection molding e.g. molding the gasket directly in the phone casing. Recyclability is an added value. The material is silicone free. The electronics industry is moving towards smaller devices with an increasing amount of special features. The smaller the device the more attention should be paid to controlling the excess heat. Cost Savings Through a Simplified Production Process:
Traditionally the silicon-based compounds and glues are used as an intermediate heat conductor from circuit board to metal plate. When choosing PRETHERM TPE compound instead, the production process will be simplified and accelerated radically; PRETHERM TPE can be co-moulded with metal without using any primers. PRETHERM TPE compounds are insulative and non-migrating and can therefore be placed directly into contact with sensitive electronics without the risk of short-circuits. Design and Processing:
Production using normal thermoplastic processing methods; injection molding and extrusion
Easy processability enables product designs with complex shapes and sizes
Mass-production friendly; fast cycle times, no need for vulcanisation nor primers
Recyclable and RoHS compliant Applications: Heat sink, gap filler between metal and electric component in mobile phones, mobile phone base stations and other electronics as well as military application. Information from Premix OY |
