MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Rulon Bearings

Lord Adhesives Thermoset™ ME-430 Epoxy Board Level Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes: LORD Thermoset™ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications.

Thermoset ME-430 encapsulant offers good adhesion to both laminate and ceramic substrates, and can be used in demanding high-end, consumer printed circuit board and semiconductor applications.

All information provided by Lord.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.80 g/cc1.80 g/cc
Brookfield Viscosity 255000 - 380000 cP
@Temperature 25.0 °C		255000 - 380000 cP
@Temperature 77.0 °F		Spindle 14 @ 1rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 91 - 9891 - 98
Modulus of Elasticity 6.00 GPa870 ksiDMA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+15 ohm-cm
@Temperature 25.0 °C		1.00e+15 ohm-cm
@Temperature 77.0 °F
Dielectric Constant 3.7
@Frequency 1e+6 Hz		3.7
@Frequency 1e+6 Hz
Dissipation Factor 0.0060
@Frequency 1e+6 Hz		0.0060
@Frequency 1e+6 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 19.0 µm/m-°C10.6 µin/in-°FBelow Tg; TMA
Glass Transition Temp, Tg 135 °C275 °FTMA
 
Processing PropertiesMetricEnglishComments
Cure Time 30.0 min
@Temperature 150 °C		0.500 hour
@Temperature 302 °F
Pot Life 1440 min
@Temperature 25.0 °C		1440 min
@Temperature 77.0 °F
Gel Time 3.50 - 5.80 min
@Temperature 150 °C		3.50 - 5.80 min
@Temperature 302 °F
Shelf Life 6.00 Month
@Temperature -40.0 °C		6.00 Month
@Temperature -40.0 °F
 
Component Elements PropertiesMetricEnglishComments
Potassium, K 0.00010 %0.00010 %
Sodium, Na 0.00050 %0.00050 %
 
Descriptive Properties
AppearanceBlack
Chloride (%)0.0005
ConsistencyPaste

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Resinlab® EP1330LV Heat Cure Epoxy Polymer System
Resinlab® EP1330 Heat Cure Epoxy Polymer System
Resinlab® EP1306 Acrylic / Epoxy Hybrid Adhesive
Epoxy Technology EPO-TEK® E3037 Epoxy
BP Amoco Acctuf® 3240 Impact Copolymer Polypropylene

PLORD089 / 86097

Aluminum Castings




Searches:   Advanced  •   Composition  •   Property  •   Material Type  •   Manufacturer  •   Trade Name  •   UNS Number
Other Links:   Advertising  •   Submit Data  •   Database Licensing  •   Web Design & Hosting  •   Trade Publications
Supplier List  •   Unit Converter  •   Reference  •   Links  •   Help  •   Contact Us  •   Site Map  •   FAQ  •   Home
 
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2025 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.