Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. For opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto optosensors. It is a higher viscosity version of EPO-TEK® B9021-1.Information Provided by Epoxy Technology |