Evonik VESTAMID® HTplus LDS1031 PA6T/X, GF10

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Evonik VESTAMID® HTplus LDS1031 PA6T/X, GF10 (discontinued **)
Categories:	Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 6 (PA6); Nylon 6, 10% Glass Fiber Filled
Material Notes:	Characterization: 10% glass fibers, mineral reinforced, medium viscosity, stabilized, qualified for LPKF LDS process, optimized shrinkage, suitable for lead-free solders Applications: Three-dimensional interconnect devices in electronic applications, specially adapted for the LDS process. Dimension-stable, glossy surface Information provided by Evonik
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Physical Properties	Metric	English	Comments

Density	1.62 g/cc	0.0585 lb/in³	ISO 1183

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	121 MPa	17500 psi	ISO 527-1/2
Elongation at Break	1.6 %	1.6 %	ISO 527-1/2
Tensile Modulus	11.5 GPa	1670 ksi	ISO 527-1/2
Charpy Impact Unnotched	2.40 J/cm² @Temperature -30.0 °C	11.4 ft-lb/in² @Temperature -22.0 °F	ISO 179/1eU
	2.90 J/cm² @Temperature 23.0 °C	13.8 ft-lb/in² @Temperature 73.4 °F	ISO 179/1eU
Charpy Impact, Notched	0.270 J/cm² @Temperature 23.0 °C	1.28 ft-lb/in² @Temperature 73.4 °F	ISO 179/1eA
	0.270 J/cm² @Temperature -30.0 °C	1.28 ft-lb/in² @Temperature -22.0 °F	ISO 179/1eA

Thermal Properties	Metric	English	Comments
Melting Point	315 °C	599 °F	ISO 11357
Deflection Temperature at 0.46 MPa (66 psi)	260 °C	500 °F	ISO 75
Deflection Temperature at 1.8 MPa (264 psi)	302 °C	576 °F	ISO 75

**
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PEVONIL265 / 196469

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