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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

Tin-Lead Eutectic Solder (63Sn-37Pb), Drop Solder (UNS L13631)
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy; Tin Alloy

Key Words: ASTM B32 (63B)
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Physical PropertiesMetricEnglishComments
Density 8.40 g/cc0.303 lb/in³
Viscosity  1.33 cP
@Temperature 280 °C
1.33 cP
@Temperature 536 °F
Dynamic viscosity
 45600 cP
@Temperature 280 °C
45600 cP
@Temperature 536 °F
Surface Tension 490 dynes/cm
@Temperature 280 °C
490 dynes/cm
@Temperature 536 °F
 
Mechanical PropertiesMetricEnglishComments
Hardness, Brinell 1414Cast
Tensile Strength, Ultimate 52.0 MPa7540 psiCast solder. Typical Cu joint is 200 MPa.
Tensile Strength, Yield 43.0 MPa6240 psi
Elongation at Break 32 %32 %in 100 mm, Cast
Modulus of Elasticity 32.0 GPa4640 ksiInterpolated
Poissons Ratio 0.380.38
Shear Modulus 12.0 GPa1740 ksiCalculated
Shear Strength 37.0 MPa5370 psiTypical soldered Cu joint is 55 MPa.
Izod Impact 20.0 J14.8 ft-lbCast
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000145 ohm-cm0.0000145 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Heat of Fusion 37.0 J/g15.9 BTU/lb
CTE, linear 24.7 µm/m-°C
@Temperature 15.0 - 110 °C
13.7 µin/in-°F
@Temperature 59.0 - 230 °F
Thermal Conductivity 50.9 W/m-K
@Temperature 0.000 - 180 °C
353 BTU-in/hr-ft²-°F
@Temperature 32.0 - 356 °F
Melting Point 183 °C361 °F
Solidus 183 °C361 °F
Liquidus 183 °C361 °F
 
Component Elements PropertiesMetricEnglishComments
Aluminum, Al <= 0.0050 %<= 0.0050 %
Antimony, Sb 0.20 - 0.50 %0.20 - 0.50 %
Arsenic, As <= 0.030 %<= 0.030 %
Bismuth, Bi <= 0.25 %<= 0.25 %
Copper, Cu <= 0.080 %<= 0.080 %
Iron, Fe <= 0.020 %<= 0.020 %
Lead, Pb 37 %37 %
Tin, Sn 63 %63 %
Zinc, Zn <= 0.0050 %<= 0.0050 %

References for this datasheet.

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MLS13631 / 205643

solder replacement adhesives

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