Solvay FM® 300-2K Film Adhesive, psf 0.1 (489 gsm)

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Solvay FM® 300-2K Film Adhesive, psf 0.1 (489 gsm)
Categories:	Polymer; Adhesive; Film
Material Notes:	Description: FM® 300-2 film adhesive is a 250°F (121°C) cure version of Cytec Engineered Materials’ widely used FM® 300 film adhesive. It delivers the same superior high temperature performance, toughness and stress/strain properties of FM 300 film adhesive without requiring a 350°F (177°C) cure cycle. In addition, FM 300-2 film adhesive’s processing window includes temperatures up to 300°F (149°C) providing a unique level of flexibility from one adhesive product. FM 300-2 adhesive was developed specifically for co-cure and secondary composite bonding applications. Through innovative curative technology, the required cure temperature is reduced allowing for secondary bonding of structure far below the composite’s glass transition point. FM 300-2 film adhesive also offers optimum flow control desirable for co-cure composite bonding. In metal bond applications, FM 300-2 film adhesive provides excellent moisture and corrosion resistance in high humidity environments with a minimal reduction in mechanical properties. To achieve consistent mechanical performance as well as maximum environmental resistance in bonding metallic details, the use of pre-cured BR® 127 corrosion inhibiting primer is recommended. FM 300-2 adhesive is available as an unsupported or supported film employing both knit and random mat carriers. A low-flow version of FM 300-2 film adhesive for composite interleaving, designated FM 300-2 interleaf adhesive, is also available. Features & Benefits: 250°F (121°C) cure version of FM 300 film adhesive Offers service temperatures from 67°F to 300°F (-55°C to 149°C) Excellent moisture and corrosion resistance in high humidity environments with no significant reduction in mechanical properties Displays similar stress/strain properties to FM 300 film adhesive under both dry and wet conditions through 220°F (104°C) Ideal for co-cure and secondary composite bonding applications. Compatible with most thermoset and thermoplastic composite systems. Applications: Co-cure and secondary composite bonding Vacuum-only processing common in repair applications Information provided by Cytec, subsequently acquired by Solvay.
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Physical Properties	Metric	English	Comments

Volatiles	<= 1.0 %	<= 1.0 %
Outgassing - Total Mass Loss	1.35 %	1.35 %	TWL
Collected Volatile Condensable Material	0.080 %	0.080 %
Storage Temperature	-18.0 °C	-0.400 °F

Mechanical Properties	Metric	English	Comments
Tensile Strength	3.76 MPa @Temperature 82.0 °C	545 psi @Temperature 180 °F	Flatwise, Immersed in water for 24 hours at 140°F (60°C), then bonded within two hours, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	3.93 MPa @Temperature 82.0 °C	570 psi @Temperature 180 °F	Flatwise, 3 weeks at 75°F (24°C), 65% RH, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	4.27 MPa @Temperature 121 °C	620 psi @Temperature 250 °F	Flatwise, Immersed in water for 24 hours at 140°F (60°C), then bonded within two hours
	4.34 MPa @Temperature 121 °C	630 psi @Temperature 250 °F	Flatwise, 3 weeks at 75°F (24°C), 65% RH
	4.83 MPa @Temperature 121 °C	700 psi @Temperature 250 °F	Flatwise
	4.83 MPa @Temperature 24.0 °C	700 psi @Temperature 75.2 °F	Flatwise, 3 weeks at 75°F (24°C), 65% RH, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	4.96 MPa @Temperature 24.0 °C	720 psi @Temperature 75.2 °F	Flatwise, Immersed in water for 24 hours at 140°F (60°C), then bonded within two hours
	5.03 MPa @Temperature 24.0 °C	730 psi @Temperature 75.2 °F	Flatwise, Immersed in water for 24 hours at 140°F (60°C), then bonded within two hours, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	5.17 MPa @Temperature 82.0 °C	750 psi @Temperature 180 °F	Flatwise, Immersed in water for 24 hours at 140°F (60°C), then bonded within two hours
	5.38 MPa @Temperature 82.0 °C	780 psi @Temperature 180 °F	Flatwise, 3 weeks at 75°F (24°C), 65% RH
	5.38 MPa @Temperature 24.0 °C	780 psi @Temperature 75.2 °F	Flatwise, 3 weeks at 75°F (24°C), 65% RH
	6.89 MPa @Temperature 82.0 °C	1000 psi @Temperature 180 °F	Flatwise
	8.48 MPa @Temperature -55.0 °C	1230 psi @Temperature -67.0 °F	Flatwise
	8.55 MPa @Temperature 24.0 °C	1240 psi @Temperature 75.2 °F	Flatwise
Shear Strength	10.7 MPa @Temperature 121 °C	1550 psi @Temperature 250 °F	Lap, Bonded Exposure: 30 days at 160°F (71°C), 100% RH, 100% Cohesive Failure
	12.5 MPa @Temperature 149 °C	1820 psi @Temperature 300 °F	Lap, Precured Composite Substrate: PEEK (APC™-2)
	15.9 MPa @Temperature 149 °C	2300 psi @Temperature 300 °F	Lap, Baseline
	16.1 MPa @Temperature 121 °C	2340 psi @Temperature 250 °F	Lap, 85% Adhesive Failure, 15% cohesive Failure
	16.7 MPa @Temperature 24.0 °C	2420 psi @Temperature 75.2 °F	Lap, 70% Cohesive Failure, 30% Laminate Failure
	17.7 MPa @Temperature 82.0 °C	2570 psi @Temperature 180 °F	Lap, 60% Cohesive Failure, 40% Laminate Failure
	17.9 MPa @Temperature 82.0 °C	2600 psi @Temperature 180 °F	Lap, Bonded Exposure: 30 days at 160°F (71°C), 100% RH, 50% Cohesive Failure, 50% Laminate Failure
	17.9 MPa @Temperature 24.0 °C	2600 psi @Temperature 75.2 °F	Lap, Bonded Exposure: 30 days at 160°F (71°C), 100% RH, 100% Laminate Failure
	21.4 MPa @Temperature -55.0 °C	3100 psi @Temperature -67.0 °F	Lap, Precured Composite Substrate: PEEK (APC™-2)
	21.9 MPa @Temperature 82.0 °C	3170 psi @Temperature 180 °F	Lap, wet, Precured Composite Substrate: PEEK (APC™-2)
	25.2 MPa @Temperature 24.0 °C	3650 psi @Temperature 75.2 °F	Lap, Precured Composite Substrate: PEEK (APC™-2)
	25.9 MPa @Temperature 121 °C	3750 psi @Temperature 250 °F	Lap; ASTM D1002
	26.9 MPa @Temperature 121 °C	3900 psi @Temperature 250 °F	Lap, Baseline
	29.5 MPa @Temperature -55.0 °C	4280 psi @Temperature -67.0 °F	Lap; ASTM D1002
	31.4 MPa @Temperature 107 °C	4560 psi @Temperature 225 °F	Lap, Cure Cycle 60 minutes 350°F (177°C)
	32.1 MPa @Temperature 107 °C	4660 psi @Temperature 225 °F	Lap, Cure Cycle 90 minutes 250°F (121°C)
	32.3 MPa @Temperature 107 °C	4680 psi @Temperature 225 °F	Lap, Cure Cycle 60 minutes 300°F (149°C)
	35.9 MPa @Temperature 82.0 °C	5200 psi @Temperature 180 °F	Lap; ASTM D1002
	37.3 MPa @Temperature 24.0 °C	5410 psi @Temperature 75.2 °F	Lap; ASTM D1002
	38.6 MPa @Temperature 24.0 °C	5600 psi @Temperature 75.2 °F	Lap, Baseline
	42.1 MPa @Temperature 24.0 °C	6100 psi @Temperature 75.2 °F	Lap, Cure Cycle 90 minutes 250°F (121°C)
	43.3 MPa @Temperature 24.0 °C	6280 psi @Temperature 75.2 °F	Lap, Cure Cycle 60 minutes 350°F (177°C)
	44.5 MPa @Temperature 24.0 °C	6460 psi @Temperature 75.2 °F	Lap, Cure Cycle 60 minutes 300°F (149°C)
Peel Strength	6.31 kN/m	36.0 pli	Floating Roller
	5.26 kN/m @Temperature 24.0 °C	30.0 pli @Temperature 75.2 °F	Floating Roller, Cure Cycle 90 minutes 250°F (121°C)
	5.96 kN/m @Temperature 24.0 °C	34.0 pli @Temperature 75.2 °F	Floating Roller, Cure Cycle 60 minutes 300°F (149°C)
	5.96 kN/m @Temperature 24.0 °C	34.0 pli @Temperature 75.2 °F	Floating Roller, Cure Cycle 60 minutes 350°F (177°C)
	6.14 kN/m @Temperature 24.0 °C	35.0 pli @Temperature 75.2 °F	Floating Roller, Bonded Exposure: 30 days at 160F (71C), 100% RH
	6.14 kN/m @Temperature 24.0 °C	35.0 pli @Temperature 75.2 °F	Floating Roller, Pre-Bond Film Exposure:15 days at 75°F (24°C), 80% RH, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	6.31 kN/m @Temperature 24.0 °C	36.0 pli @Temperature 75.2 °F	Floating Roller, Pre-Bond Film Exposure
	6.31 kN/m @Temperature 121 °C	36.0 pli @Temperature 250 °F	Floating Roller, Pre-Bond Film Exposure
	6.49 kN/m @Temperature 121 °C	37.0 pli @Temperature 250 °F	Floating Roller, Pre-Bond Film Exposure:15 days at 75°F (24°C), 80% RH
	6.84 kN/m @Temperature 121 °C	39.0 pli @Temperature 250 °F	Floating Roller, Bonded Exposure: 30 days at 160F (71C), 100% RH
	6.84 kN/m @Temperature 121 °C	39.0 pli @Temperature 250 °F	Floating Roller, Pre-Bond Film Exposure:15 days at 75°F (24°C), 80% RH, Bonded Exposure: 30 days at 160°F (71°C), 100% RH
	7.01 kN/m @Temperature 24.0 °C	40.0 pli @Temperature 75.2 °F	Floating Roller, Pre-Bond Film Exposure:15 days at 75°F (24°C), 80% RH
	7.54 kN/m @Temperature 107 °C	43.0 pli @Temperature 225 °F	Floating Roller, Cure Cycle 90 minutes 250°F (121°C)
	7.89 kN/m @Temperature 107 °C	45.0 pli @Temperature 225 °F	Floating Roller, Cure Cycle 60 minutes 300°F (149°C)
	8.59 kN/m @Temperature 107 °C	49.0 pli @Temperature 225 °F	Floating Roller, Cure Cycle 60 minutes 350°F (177°C)

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	149 °C	300 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F
Glass Transition Temp, Tg	140 °C	284 °F	Lap, Cure Cycle 60 minutes 300°F (149°C)
	140 °C	284 °F	Lap, Cure Cycle 60 minutes 350°F (177°C)
	143 °C	289 °F	Lap, Cure Cycle 90 minutes 250°F (121°C)
	144 °C	291 °F

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month	12.0 Month

Descriptive Properties
Color	Red
Honeycomb Sandwich Peel	53 Nm/m		-55°C
	74 Nm/m		24°C
	74 Nm/m		121°C
Metal-to-Metal Climbing Drum Peel	150 Nm/m		24°C
	170 Nm/m		82°C
	170 Nm/m		121°C
	71 Nm/m		Cure Cycle 90 minutes 250°F (121°C), 24°C
	74 Nm/m		Cure Cycle 90 minutes 250°F (121°C), 107°C
	74 Nm/m		Cure Cycle 60 minutes 350°F (177°C), 24°C
	76 Nm/m		-55°C
	77 Nm/m		Cure Cycle 60 minutes 300°F (149°C), 24°C
	81 Nm/m		Cure Cycle 60 minutes 300°F (149°C), 107°C
	89 Nm/m		Cure Cycle 60 minutes 350°F (177°C), 107°C

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PCYTED112 / 180414

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