| The Accuglass T-11 (k = 3.8) Spin-on Glass (SOG) Series is a family of methylsiloxane polymers used for interlevel and overcoat passivation in the manufacture of integrated circuits. The AccuglassT-11 series is specially formulated to fill narrow (down to 0.3µm), high aspect ratio (up to 4) gaps without voids while planarizing multi-level metal devices. AccuglassT-11 contains 10 wt% CH3 (methyl) groups bonded to Si atoms in the Si-O backbone. The specific formulation results in a stable dielectric constant, high crack resistance, excellent gap fill and planarization properties of the cured film. Thin films of AccuglassT-11 are applied using a commercial coater and cured in a vertical or horizontal furnace to thicknesses up to 3800Å (single coat) and 6000Å (double coat). Benefits - Industry proven performance and broad acceptance
- T-11 fills gaps as small as 0.3µm
- High thermal stability. Compatible with hot aluminum and tungsten plug processing. Permeability allows for hydrogen annealing of gate oxides
- Thickness variation within a wafer of less than 1%. Wafer to wafer variation of less than 2%
- Lower dielectric constant compared to silicates and phosphorus silicates
- Crack resistance up to 6000Å
- Good adhesion to top and bottom dielectric layers
Applications:- ILD and PMD Planarization
- Overcoat Passivation
- Gapfill
AccuglassT-11 is suitable for gap fill and planarization of ILD and PMD structures used in multilevel metal IC devices. Typically, partial etchback (PEB) is used for ILD and total etchback (TEB) is used for PMD. AccuglassT-11 can also be used to improve planarization of the final passivation layer.Information provided by Honeywell |
