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Chemically Resistant adhesives

Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Glass Fiber Filler; Filled/Reinforced Thermoset

Material Notes: Epoxy is the premier material for military firewall connectors.

Information provided by Sumitomo Bakelite North America, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.95 g/cc0.0704 lb/in³ASTM D792
Water Absorption 0.30 %0.30 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0020 - 0.0040 cm/cm0.0020 - 0.0040 in/inCompression Molding. ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 7373
Tensile Strength, Ultimate 65.0 MPa9430 psiASTM D638
Flexural Yield Strength 117 MPa17000 psiASTM D790
Flexural Modulus 13.8 GPa2000 ksiASTM D790
Compressive Yield Strength 214 MPa31000 psiASTM D695
Izod Impact, Notched 0.320 J/cm0.599 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4.04.0Wet; ASTM D150
Dielectric Strength 11.0 kV/mm279 kV/inWet, short term. ASTM D149
Dissipation Factor 0.020
@Frequency 1e+6 Hz
0.020
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 175 sec175 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 47.0 µm/m-°C
@Temperature 20.0 °C
26.1 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Thermal Conductivity 0.586 W/m-K4.07 BTU-in/hr-ft²-°FASTM F433
Deflection Temperature at 1.8 MPa (264 psi) 260 °C500 °FASTM D648A
Oxygen Index 38 %38 %ASTM D2863
 
Processing PropertiesMetricEnglishComments
Mold Temperature 143 - 177 °C289 - 351 °Fcompression/transfer molding.
 174 - 182 °C345 - 360 °Finjection molding.

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PROG58 / 66269

Chemically Resistant adhesives

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