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Metal adhesives

Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Electrically insulating
  • Highly flexiblized
  • Room temperature curing
  • Cryogenically serviceable down to 4K
  • High peel strength and elongation
  • Good flow properties
Product Description: Master Bond EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It has a forgiving one to three mix ratio by weight. The system is formulated to cure fully at ambient temperature or more quickly at elevated temperatures. The optimum cure schedule is overnight at room temperature followed by 2-3 hours at 150-200°F. An unusual feature here is that the curing cycle can affect the hardness of the system. If cured only at elevated temperatures, the Shore A hardness is 50-55. If cured with the optimum cure schedule, the Shore A is 75-80. It has very high peel strength and elongation. EP21TDC-2 develops very little exotherm while curing, making it well suited for sealing or encapsulating in thicker sections. It has excellent adhesion to a wide array of substrates including metals, composites, glass, ceramics and many rubbers and plastics. Its superior flexibility allows EP21TDC-2 to have excellent thermal cycling properties along with exceptional resistance to thermal and mechanical shock and vibration. This epoxy is a superb electrical and thermal insulator with good resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. EP21TDC-2 is cryogenically serviceable and has a temperature range of 4K to +250°F. EP21TDC-2 is widely used in aerospace, specialty OEM, optical and especially in applications where robust thermal cycling properties and shock resistance are paramount.

Product Advantages:

  • Easy application: good flow, product spreads evenly and smoothly
  • Cures readily at ambient temperature or faster at elevated temperatures
  • Variable hardness and flexibility depending upon cure schedule
  • Bonds well to a wide variety of substrates
  • Excellent peel strength, dependable resistance to rigorous thermal cycling
  • Cryogenic serviceability

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Viscosity 10000 - 20000 cP10000 - 20000 cPPart A
 150000 - 300000 cP150000 - 300000 cPPart B
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 50 - 5550 - 55Cured at 150-200°F
 75 - 8075 - 80Cured with optimum schedule
Tensile Strength >= 34.5 MPa>= 5000 psi
Adhesive Bond Strength >= 8.27 MPa>= 1200 psiTensile lap, Aluminum to Aluminum
Peel Strength >= 5.26 kN/m>= 30.0 pli
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cm
Dielectric Constant 3.6
@Frequency 60 Hz
3.6
@Frequency 60 Hz
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 1.4423 W/m-K10.010 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C400 °F
Minimum Service Temperature, Air -167 °C-269 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 2880 - 4320 min
@Temperature 23.9 °C
48.0 - 72.0 hour
@Temperature 75.0 °F
Working Life >= 60.0 min>= 60.0 minAfter mixing, 100 g batch
Shelf Life 12.0 Month
@Temperature <=23.9 °C
12.0 Month
@Temperature <=75.0 °F
in original, unopened containers
 
Descriptive Properties
Cure ScheduleOvernight at 75°Ffollowed by 2-3 hours at 200°F, Optimum cure
Mixing Ratio1:3 by weightParts A to B

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PMASTM832 / 185425

Metal adhesives

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