Hexcel® Redux® 340U(SP) (0.03 psf) Modified epoxy film adhesive for bonding metallic and composite components

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Hexcel® Redux® 340U(SP) (0.03 psf) Modified epoxy film adhesive for bonding metallic and composite components
Categories:	Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Redux® 340U(SP) is a high temperature modified epoxy film adhesive curing at 175°C (350°F). It was developed as a low weight film adhesive for space applications. It is suitable for bonding metal to metal, where operating temperatures are experienced up to 200°C (392°F) for short periods, or 180°C (356°F) for continuous operation. Redux® 340U(SP) is a hot melt film which is free from solvents and consequently has a very low volatile content. Features: Cures in 1 hour at 175°C (350°F); Good hot lap shear performance up to 180°C(356°F); Excellent metal-metal peel properties; Excellent drape and handleability; Good reticulating characteristics; very low volatile content and low outgassing properties; Only available un-supported. Applications: Metal to metal bonding; Composite to composite bonding; Space applications.
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Physical Properties	Metric	English	Comments

Outgassing - Total Mass Loss	0.109 %	0.109 %	Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
	1.168 %	1.168 %	Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material	0.00 %	0.00 %	ESA PSS-01-702

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	180 °C	356 °F
	200 °C	392 °F

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties
Roll Width (in)	39.4
Standard Roll (ft2)	538

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PHEXC463 / 99282

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