USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Oxygen-free Copper (OF), UNS C10200, H04 Temper, wire

Most of the data in MatWeb has been supplied directly by companies in the supply chain - the manufacturers, or, less commonly, distributors or fabricators. Other data has been provided by standards organizations or from similar materials/known relationships by the MatWeb staff. For more information about this specific material, see the following source(s):

ASM Engineered Materials Reference Book, Second Edition, Michael Bauccio, Ed. ASM International, Materials Park, OH, 1994.

ASM Metals Reference Book, Third edition, Michael Bauccio, Ed. ASM International, Materials Park, OH, 1993.

Metals Handbook, Vol.2 - Properties and Selection: Nonferrous Alloys and Special-Purpose Materials, ASM International 10th Ed. 1990.

Metals Handbook, 9th Ed., v.2, ASM Handbook Committee, American Society for Metals, USA, 1979.

The Materials Selector, 2nd ed., edited by Norman A. Waterman and Michael F. Ashby, Chapman & Hall, London, UK, 1997

Metals Handbook, 10th Ed., v.2, ASM Handbook Committee, American Society for Metals, USA, 1990.

ASM Specialty Handbook - Copper and Copper Alloys, edited by Joseph R. Davis, Davis & Associates, ASM International, Metals Park, OH, (2001).

Information provided by the Copper Development Association, Inc.