Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound

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Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C. Also can be used as a high temperature wire varnish/impregnant for motor stators. Available as a long pot-life, 2-component system. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	1.20 g/cc	0.0434 lb/in³	ASTM D1475
Viscosity	2400 cP	2400 cP	Spindle #2; speed 10 rpm; ASTM D1824
Outgassing - Total Mass Loss	0.10 %	0.10 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.010 %	0.010 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	88	88	Cured property; ASTM D2240

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.3 @Frequency 1000 Hz	3.3 @Frequency 1000 Hz	Cured property; ASTM D150
Dissipation Factor	0.0090 @Frequency 1000 Hz	0.0090 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	72.0 µm/m-°C @Temperature 20.0 °C	40.0 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	200 µm/m-°C @Temperature 20.0 °C	111 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Maximum Service Temperature, Air	220 °C	428 °F
Glass Transition Temp, Tg	165 °C	329 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 200 °C	>= 392 °F	ASTM D92

Descriptive Properties
Color	Clear Amber

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PAPTEK39 / 24201

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