Aptek 2313-PMF Hybrid Epoxy Adhesive

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Aptek 2313-PMF Hybrid Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant. Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/"tack" strength-holds components with minimal "Z" axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Low Tg (<-50°C) for excellent low temperature cycling and performance with minimal stress. Excellent substrate adhesion; superior to silicones: no primer required. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	3.00 g/cc	0.108 lb/in³	ASTM D1475

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	2.24 MPa	325 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.0030 ohm-cm	0.0030 ohm-cm	Cured property; ASTM D257

Thermal Properties	Metric	English	Comments
Thermal Conductivity	>= 1.50 W/m-K	>= 10.4 BTU-in/hr-ft²-°F	COLORA
Glass Transition Temp, Tg	<= -50.0 °C	<= -58.0 °F	Cured property; Perkin Elmer TM-2
Flash Point	>= 200 °C	>= 392 °F	ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	85.0 °C	185 °F	Cure 120 min.
	125 °C	257 °F	Cure 30 min.
	260 °C	500 °F	Cure 30 sec; through solder reflow process

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PAPTEK14 / 24176

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