Aptek DIS-A-PASTE 2000-A/B Thermally conductive urethane adhesive

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Aptek DIS-A-PASTE 2000-A/B Thermally conductive urethane adhesive
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	DIS-A-PASTE 200-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2000-A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. DIS-A-PASTE 2000-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2000-B is a clear yellow, organic isocyanate. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	1.19 - 1.29 g/cc	0.0430 - 0.0466 lb/in³	B Component; ASTM D1475
	2.02 - 2.12 g/cc	0.0730 - 0.0766 lb/in³	A Component; ASTM D1475
Viscosity	45 cP	45 cP	B Component; ASTM D1824
	115000 cP	115000 cP	A Component; ASTM D1824
Outgassing - Total Mass Loss	0.15 %	0.15 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.0040 %	0.0040 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	83	83	Cured property @ 1/2 inch casting; ASTM D2240
Adhesive Bond Strength	2.93 MPa	425 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Electrical Properties	Metric	English	Comments
Volume Resistivity	7.00e+14 ohm-cm	7.00e+14 ohm-cm	Cured property; ASTM D257
Dielectric Constant	5.8 @Frequency 1000 Hz	5.8 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	13.4 kV/mm @Thickness 3.17 mm	340 kV/in @Thickness 0.125 in	Cured; ASTM D149
Dissipation Factor	0.030 @Frequency 1000 Hz	0.030 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	31.0 µm/m-°C @Temperature 20.0 °C	17.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1
	147 µm/m-°C @Temperature 20.0 °C	81.7 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2
Thermal Conductivity	0.744 W/m-K	5.16 BTU-in/hr-ft²-°F	Cured Property; E1225
Glass Transition Temp, Tg	-60.0 °C	-76.0 °F	Cured property; JMTP P-200
Flash Point	>= 150 °C	>= 302 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	80.0 °C	176 °F	Cure 8 hrs
	100 °C	212 °F	Cure 4 hrs

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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