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Metal adhesives

Master Bond EP34AN-1 Two Component Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, High Temperature; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • Superlative thermal conductivity
  • Exceptional electrical insulation properties
  • Temperature resistance up to +450°F
  • Outstanding thermal cycling capabilities
Product Description: Master Bond EP34AN-1 is a two part, room temperature curing epoxy system for bonding, sealing and coating featuring high temperature resistance, sterling thermal cycling capabilities, first rate thermal conductivity and peerless electrical insulation properties. It is very easy to work with as it has a 100 to 70 mix ratio by weight which works out to a very convenient one to one ratio by volume. This system cures readily at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure at 150-200°F for 2-3 hours. Upon polymerization EP34AN-1 is serviceable from -60°F to +450°F. Another noteworthy characteristic is its superior dimensional stability. It resists a range of chemicals including water, oils, fuels and many acids and bases. This thixotropic system bonds well to a wide variety of substrates including metal, composites, glass, ceramics and many rubbers and plastics. As previously mentioned, EP34AN-1 combines thermal conductivity, electrical insulation, the ability to withstand rigorous thermal cycling and an array of superior physical strength properties. EP34AN-1 is 100% reactive and does not contain any diluents or solvents. The color of Part A is gray, Part B is gray. It is widely used in aerospace, electronic, electrical and specialty OEM type applications among others where the combination of properties mentioned above is desirable.

Product Advantages:

  • Convenient mixing: one to one ratio by volume
  • Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
  • High temperature resistance up to 450°F
  • Combines exceptionally high thermal conductivity and fine electrical insulation properties
  • Very good dimensional stability
  • Capable of withstanding rigorous thermal cycling
  • Superb adhesion to a wide variety of substrates

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Mechanical PropertiesMetricEnglishComments
Hardness, Shore D >= 85>= 85
Tensile Strength >= 51.7 MPa>= 7500 psi
Adhesive Bond Strength >= 15.2 MPa>= 2200 psiTensile lap, Aluminum to Aluminum
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cm
Dielectric Constant 4.5
@Frequency 60 Hz
4.5
@Frequency 60 Hz
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 1.30 - 1.44 W/m-K9.02 - 9.99 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 232 °C450 °F
Minimum Service Temperature, Air -51.1 °C-60.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 2880 - 4320 min
@Temperature 23.9 °C
48.0 - 72.0 hour
@Temperature 75.0 °F
Working Life 60.0 - 90.0 min60.0 - 90.0 minAfter mixing, 100 g batch
Shelf Life 6.00 - 12.0 Month
@Temperature <=23.9 °C
6.00 - 12.0 Month
@Temperature <=75.0 °F
in original, unopened containers
 
Descriptive Properties
Cure ScheduleOvernight at 75°Ffollowed by 2-3 hours at 150-200°F
Mixing Ratio1:1 by volumeParts A to B
 100:70 by weightParts A to B
Viscositythixotropic pastePart A
 thixotropic pastePart B

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PMASTM871 / 185464

Metal adhesives

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