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Master Bond adhesives

Oxygen-free Copper (OF), UNS C10200, H04 Temper, wire
Categories: Metal; Nonferrous Metal; Copper Alloy; Wrought Copper

Material Notes: Test specimen: wire, 2 mm diam, H04 temper.

Applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass-to-metal seals, coaxial cables, klystrons, microwave tubes, and rectifiers.

Processing: Excellent hot and cold workability; good forgeability. Fabricated by bending, coining, coppersmithing, drawing and upsetting, hot forging and pressing, knurling, roll threading, shearing, spinning, swaging, and stamping.

Corrosion Resistance: Good to excellent. Susceptible to galvanic corrosion when coupled with iron, aluminum, magnesium, lead, tin, and zinc. Good resistance to atmospheric, brackish water, sea water, and non-oxidizing acid corrosion, but avoid heating in oxidizing atmospheres or exposing to oxidizing acids, moist halogens, sulfides, ammonia, or solutions with ammonium ions.

UNS C10200 - ASTM B1, B2, B3, B33, B47, B116, B189, B246, B286, B298, B355, F68; C103 (UK); CDA 102 OF; CEN CW009A; ISO Cu-OF R1337; JIS C1020 (Japan); MIL SPEC MIL-W-3318; QQ-C-502, QQ-W-343

Key Words: ASTM B1, B2, B3, B33, B47, B116, B189, B246, B286, B298, B355, C110, BS C110, ISO Cu-OF R1337, CEN CW009A, oxygen free high conductivity copper (OFHC), MIL SPEC MIL-W-3318, QQ-C-502, QQ-W-343, CDA 102 OF
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Physical PropertiesMetricEnglishComments
Density 8.94 g/cc0.323 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 380 MPa55100 psi
Elongation at Break 1.5 %1.5 %in 1500 mm (60 in).
Modulus of Elasticity 115 GPa16700 ksi
Poissons Ratio 0.310.31
Machinability 20 %20 %UNS C36000 (free-cutting brass) = 100%
Forgeability 65 %65 %UNS C37700 (forging brass) = 100%
Shear Modulus 44.0 GPa6380 ksi
Shear Strength 200 MPa29000 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000171 ohm-cm
@Temperature 20.0 °C
0.00000171 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear  17.0 µm/m-°C
@Temperature 20.0 - 100 °C
9.44 µin/in-°F
@Temperature 68.0 - 212 °F
 17.3 µm/m-°C
@Temperature 20.0 - 200 °C
9.61 µin/in-°F
@Temperature 68.0 - 392 °F
 17.7 µm/m-°C
@Temperature 20.0 - 300 °C
9.83 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C
@Temperature 20.0 °C
0.0920 BTU/lb-°F
@Temperature 68.0 °F
Thermal Conductivity 391 W/m-K
@Temperature 20.0 °C
2710 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
Melting Point 1083 °C1981 °F
Annealing Point >= 371 °C>= 700 °F
 
Processing PropertiesMetricEnglishComments
Annealing Temperature 375 - 650 °C707 - 1200 °F
Hot-Working Temperature 750 - 875 °C1380 - 1610 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu >= 99.95 %>= 99.95 %includes silver (minimum 99.95% Cu+Ag)

References for this datasheet.

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MC10200b8 / 10350

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