Overview of materials for Epoxy Molding Compound

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Overview of materials for Epoxy Molding Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropriate MatWeb entries. The comments report the average value, and number of data points used to calculate the average. The values are not necessarily typical of any specific grade, especially less common values and those that can be most affected by additives or processing methods.
Vendors:	Master Bond is a leading manufacturer of high performance epoxy adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Our epoxies include one and two part formulations that can be cured at room temperature, with heat or exposure to UV light. Special formulations feature high electrical and/or thermal conductivity and wide service temperature ranges. Visit www.masterbond.com. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Density	0.550 - 4.98 g/cc	0.0199 - 0.180 lb/in³	Average value: 1.88 g/cc Grade Count:108
Water Absorption	0.00340 - 0.900 %	0.00340 - 0.900 %	Average value: 0.180 % Grade Count:43
Moisture Absorption at Equilibrium	0.230 - 0.600 %	0.230 - 0.600 %	Average value: 0.363 % Grade Count:12
Viscosity	600 - 45000 cP @Temperature 165 - 175 °C	600 - 45000 cP @Temperature 329 - 347 °F	Average value: 6480 cP Grade Count:48
	1700 - 1700 cP @Temperature 175 - 175 °C	1700 - 1700 cP @Temperature 347 - 347 °F	Average value: 6480 cP Grade Count:1
	1700 - 1700 cP @Diameter 0.500 - 0.500 mm	1700 - 1700 cP @Diameter 0.0197 - 0.0197 in	Average value: 6480 cP Grade Count:1
Linear Mold Shrinkage	0.0000900 - 0.0150 cm/cm	0.0000900 - 0.0150 in/in	Average value: 0.00273 cm/cm Grade Count:65
Spiral Flow	10.0 - 180 cm	3.94 - 70.9 in	Average value: 97.0 cm Grade Count:60
Ash	71.4 - 88.6 %	71.4 - 88.6 %	Average value: 79.3 % Grade Count:37

Mechanical Properties	Metric	English	Comments
Hardness, Rockwell M	85.0 - 105	85.0 - 105	Average value: 98.3 Grade Count:3
Hardness, Shore D	55.0 - 86.0	55.0 - 86.0	Average value: 76.1 Grade Count:55
Tensile Strength, Ultimate	13.8 - 300 MPa	2000 - 43500 psi	Average value: 85.2 MPa Grade Count:51
Elongation at Break	0.300 - 2.00 %	0.300 - 2.00 %	Average value: 0.864 % Grade Count:11
Modulus of Elasticity	1.38 - 46.0 GPa	200 - 6670 ksi	Average value: 17.3 GPa Grade Count:16
Flexural Yield Strength	35.5 - 400 MPa	5150 - 58000 psi	Average value: 136 MPa Grade Count:99
	6.86442 - 58.8399 MPa @Temperature 215 - 260 °C	995.602 - 8534.01 psi @Temperature 419 - 500 °F	Average value: 28.0 MPa Grade Count:26
Flexural Modulus	2.41 - 32.0 GPa	349 - 4640 ksi	Average value: 16.3 GPa Grade Count:94
	0.686465 - 10.1008 GPa @Temperature 215 - 260 °C	99.5649 - 1465.03 ksi @Temperature 419 - 500 °F	Average value: 4.23 GPa Grade Count:26
Compressive Yield Strength	6.89 - 350 MPa	1000 - 50800 psi	Average value: 195 MPa Grade Count:48
Compressive Modulus	1.03 - 35.0 GPa	150 - 5080 ksi	Average value: 8.95 GPa Grade Count:5
Adhesive Bond Strength	8.96 - 15.9 MPa	1300 - 2310 psi	Average value: 11.7 MPa Grade Count:3
	13.8 - 15.9 MPa @Temperature -55.0 - 93.0 °C	2000 - 2310 psi @Temperature -67.0 - 199 °F	Average value: 14.9 MPa Grade Count:1
Izod Impact, Notched	0.160 - 21.0 J/cm	0.300 - 39.3 ft-lb/in	Average value: 3.06 J/cm Grade Count:31
Charpy Impact Unnotched	0.200 - 0.900 J/cm²	0.952 - 4.28 ft-lb/in²	Average value: 0.610 J/cm² Grade Count:5
Charpy Impact, Notched	0.150 - 8.00 J/cm²	0.714 - 38.1 ft-lb/in²	Average value: 3.30 J/cm² Grade Count:15

Electrical Properties	Metric	English	Comments
Electrical Resistivity	5080 - 5.60e+16 ohm-cm	5080 - 5.60e+16 ohm-cm	Average value: 9.75e+15 ohm-cm Grade Count:46
	1.00e+9 - 3.20e+12 ohm-cm @Temperature 150 - 150 °C	1.00e+9 - 3.20e+12 ohm-cm @Temperature 302 - 302 °F	Average value: 1.03e+12 ohm-cm Grade Count:8
Surface Resistance	1.00e+12 - 1.00e+15 ohm	1.00e+12 - 1.00e+15 ohm	Average value: 2.31e+14 ohm Grade Count:5
Dielectric Constant	1.80 - 7.00	1.80 - 7.00	Average value: 3.98 Grade Count:79
Dielectric Strength	1.40 - 55.1 kV/mm	35.6 - 1400 kV/in	Average value: 19.6 kV/mm Grade Count:83
Dissipation Factor	0.000300 - 0.0500	0.000300 - 0.0500	Average value: 0.0115 Grade Count:68
Arc Resistance	120 - 240 sec	120 - 240 sec	Average value: 176 sec Grade Count:48
Comparative Tracking Index	200 - 600 V	200 - 600 V	Average value: 433 V Grade Count:13

Thermal Properties	Metric	English	Comments
CTE, linear	3.30 - 80.0 µm/m-°C	1.83 - 44.4 µin/in-°F	Average value: 30.0 µm/m-°C Grade Count:79
	15.0 - 25.0 µm/m-°C @Temperature 50.0 - 150 °C	8.33 - 13.9 µin/in-°F @Temperature 122 - 302 °F	Average value: 19.2 µm/m-°C Grade Count:3
CTE, linear, Transverse to Flow	27.0 - 80.0 µm/m-°C	15.0 - 44.4 µin/in-°F	Average value: 53.5 µm/m-°C Grade Count:29
Thermal Conductivity	0.400 - 3.60 W/m-K	2.78 - 25.0 BTU-in/hr-ft²-°F	Average value: 0.785 W/m-K Grade Count:58
Maximum Service Temperature, Air	93.0 - 250 °C	199 - 482 °F	Average value: 159 °C Grade Count:12
Deflection Temperature at 1.8 MPa (264 psi)	122 - 282 °C	252 - 540 °F	Average value: 248 °C Grade Count:31
Deflection Temperature at 8.0 MPa	115 - 180 °C	239 - 356 °F	Average value: 145 °C Grade Count:5
Glass Transition Temp, Tg	75.0 - 228 °C	167 - 442 °F	Average value: 174 °C Grade Count:64
Flammability, UL94	HB - V-0	HB - V-0	Grade Count:62
Oxygen Index	28.0 - 34.0 %	28.0 - 34.0 %	Average value: 31.8 % Grade Count:18

Processing Properties	Metric	English	Comments
Processing Temperature	52.0 - 193 °C	126 - 379 °F	Average value: 167 °C Grade Count:19
Mold Temperature	130 - 190 °C	266 - 374 °F	Average value: 172 °C Grade Count:47
Cycle Time - Injection	30.0 - 150 sec	30.0 - 150 sec	Average value: 82.0 sec Grade Count:5
Cure Time	0.250 - 10100 min	0.00417 - 168 hour	Average value: 489 min Grade Count:28
	0.000 - 720 min @Temperature 65.0 - 177 °C	0.000 - 12.0 hour @Temperature 149 - 351 °F	Average value: 131 min Grade Count:35
Pot Life	4.00 - 60.0 min	4.00 - 60.0 min	Average value: 25.0 min Grade Count:3

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Overview of materials for Epoxy Cure Resin
Overview of materials for Epoxy, Cast, Unreinforced
Overview of materials for Vinyl Ester Sheet Molding Compound
Overview of materials for Epoxy, Molded, Glass Fiber Filler
Overview of materials for Epoxy Adhesive

O1707 / 77892

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message