Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed molding compound 1.5 mm / HB (BK). Applications: Electrical parts, thermally, chemically and mechanically stressed parts, e.g. terminal boards, bobbins, car electronic, reflectors, spark plug connectors |