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Master Bond adhesives

Selenis SELEKT XP 311 PCTG Copolyester for Injection Molding
Categories: Polymer; Thermoplastic; Polyester, TP; Polycyclohexylenedimethylene Terephthalate (PCT); Glycol-Modified PCT (PCTG) Copolyester

Material Notes: Selenis Selekt XP 311 is a copolyester that is suitable for injection molding applications. From thin wall and intricate parts to thicker cross-sections where toughness is required. Injection molded parts made from Selenis Selekt XP 311 are water-clear and glossy, whilst virtually unbreakable. Selenis Selekt XP 311 features excellent impact strength and outstanding chemical resistance. Fast injection cycles are possible due to high flowability. Thanks to Selenis Selekt XP 311 high dimensional stability, multiple parts products may be assembled with snap-fit connectors, maintaining the strength required to sustain daily wear and tear. Molded parts maybe sterilized by Gamma-radiation or EtO sterilization process Selenis Selekt XP 311 is a ready-to-use product supplied with a demolding agent to ease processing.

Information provided by Selenis.

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Physical PropertiesMetricEnglishComments
Bulk Density 0.790 g/cc0.0285 lb/in³
Density 1.26 g/cc0.0455 lb/in³ASTM D792
Water Absorption <= 0.13 %<= 0.13 %ASTM D570
Viscosity Test 76 - 80 cm³/g0.76 - 0.80 dl/gIntrinsic; ISO 1628-5
Linear Mold Shrinkage 0.0020 - 0.0050 cm/cm0.0020 - 0.0050 in/inASTM D 955
ASTM Color <= 1.0<= 1.0b*; ASTM D6290
 >= 64>= 64L*; ASTM D6290
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7878ASTM D2240
Tensile Strength 44.9 MPa6510 psi(σm); ISO 527 -1/- 2
Tensile Strength, Yield 44.9 MPa6510 psi(σy); ISO 527 -1/- 2
Elongation at Break 319 %319 %Nominal, (εtb); ISO 527 -1/- 2
Elongation at Yield 4.3 %4.3 %(εm); ISO 527 -1/- 2
 4.5 %4.5 %(εy); ISO 527 -1/- 2
Tensile Modulus 1.93 GPa280 ksiISO 527 -1/- 2
Flexural Strength 56.4 MPa8180 psiISO 178
Flexural Modulus 1.776 GPa257.6 ksiISO 178
Izod Impact, Notched (ISO)  5.70 kJ/m²
@Temperature -30.0 °C
2.71 ft-lb/in²
@Temperature -22.0 °F
ISO 180/A
 6.50 kJ/m²
@Temperature 0.000 °C
3.09 ft-lb/in²
@Temperature 32.0 °F
ISO 180/A
 7.50 kJ/m²
@Temperature 23.0 °C
3.57 ft-lb/in²
@Temperature 73.4 °F
50% RH; ISO 180/A
Izod Impact, Unnotched (ISO)  NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
ISO 180/U
 NB
@Temperature 0.000 °C
NB
@Temperature 32.0 °F
ISO 180/U
 NB
@Temperature 23.0 °C
NB
@Temperature 73.4 °F
50% RH; ISO 180/U
Charpy Impact Unnotched  NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
ISO 179-1/1eU
 NB
@Temperature 0.000 °C
NB
@Temperature 32.0 °F
ISO 179-1/1eU
 NB
@Temperature 23.0 °C
NB
@Temperature 73.4 °F
50% RH; ISO 179-1/1eU
Charpy Impact, Notched  0.570 J/cm²
@Temperature -30.0 °C
2.71 ft-lb/in²
@Temperature -22.0 °F
ISO 179-1/1eA
 0.650 J/cm²
@Temperature 0.000 °C
3.09 ft-lb/in²
@Temperature 32.0 °F
ISO 179-1/1eA
 0.750 J/cm²
@Temperature 23.0 °C
3.57 ft-lb/in²
@Temperature 73.4 °F
50% RH; ISO 179-1/1eA
Puncture Energy 44.2 J32.6 ft-lbImpact Behavior, Energy Maximum Load; ISO 6603-2/3.3 m/s
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 0.46 MPa (66 psi) 67.6 °C154 °FISO 75-1/-2
Deflection Temperature at 1.8 MPa (264 psi) 60.0 °C140 °FISO 75-1/-2
Glass Transition Temp, Tg 88.0 °C190 °FASTM D3418
 
Optical PropertiesMetricEnglishComments
Haze <= 1.0 %
@Thickness 2.00 mm
<= 1.0 %
@Thickness 0.0787 in
ASTM D1003
Gloss 167 %167 %60º; ASTM D2457
Yellow Index <= 1.0 %
@Thickness 2.00 mm
<= 1.0 %
@Thickness 0.0787 in
ASTM (E313-73)
Transmission, Visible  80 %
@Thickness 5.00 - 6.00 mm,
Wavelength 400 nm
80 %
@Thickness 0.197 - 0.236 in,
Wavelength 400 nm
Disk
 82 %
@Thickness 4.00 mm,
Wavelength 400 nm
82 %
@Thickness 0.157 in,
Wavelength 400 nm
Disk
 84 %
@Thickness 3.00 mm,
Wavelength 400 nm
84 %
@Thickness 0.118 in,
Wavelength 400 nm
Disk
 85 %
@Thickness 2.00 mm,
Wavelength 400 nm
85 %
@Thickness 0.0787 in,
Wavelength 400 nm
Disk
 87 %
@Thickness 4.00 - 6.00 mm,
Wavelength 440 - 660 nm
87 %
@Thickness 0.157 - 0.236 in,
Wavelength 440 - 660 nm
Disk
 88 %
@Thickness 1.00 mm,
Wavelength 400 nm
88 %
@Thickness 0.0394 in,
Wavelength 400 nm
Disk
 89 %
@Thickness 1.00 - 3.00 mm,
Wavelength 440 - 660 nm
89 %
@Thickness 0.0394 - 0.118 in,
Wavelength 440 - 660 nm
Disk
 89 %
@Thickness 1.00 - 6.00 mm,
Wavelength 660 - 740 nm
89 %
@Thickness 0.0394 - 0.236 in,
Wavelength 660 - 740 nm
Disk
UV Transmittance  60 %
@Thickness 5.00 - 6.00 mm,
Wavelength 370 nm
60 %
@Thickness 0.197 - 0.236 in,
Wavelength 370 nm
Disk
 65 %
@Thickness 4.00 mm,
Wavelength 370 nm
65 %
@Thickness 0.157 in,
Wavelength 370 nm
Disk
 70 %
@Thickness 3.00 mm,
Wavelength 370 nm
70 %
@Thickness 0.118 in,
Wavelength 370 nm
Disk
 75 %
@Thickness 2.00 mm,
Wavelength 370 nm
75 %
@Thickness 0.0787 in,
Wavelength 370 nm
Disk
 83 %
@Thickness 1.00 mm,
Wavelength 370 nm
83 %
@Thickness 0.0394 in,
Wavelength 370 nm
Disk
 
Processing PropertiesMetricEnglishComments
Melt Temperature 180 - 250 °C356 - 482 °F
Drying Temperature <= 74.0 °C<= 165 °Fto avoid chips sticking together in dryer hopper
 >= 70.0 °C
@Time 21600 - 28800 sec
>= 158 °F
@Time 6.00 - 8.00 hour
Moisture Content <= 0.0040 %<= 0.0040 %dried
Dew Point -40.0 °C-40.0 °F
 
Descriptive Properties
Particle size320 ± 50 mg/20 chips
Pellet ShapeCylindrical

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PSELE952 / 243450

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