AIM 100In Solder for Photonic Packaging

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

AIM 100In Solder for Photonic Packaging
Categories:	Metal; Nonferrous Metal; Indium Alloy; Solder/Braze Alloy; Pure Element
Material Notes:	Uses include: Fiber to Ferrule Soldering Laser Die Attach Hermetic Packaging & Sealing Wetting & Sealing Laser Optics Thermal Management Information provided by AIM Specialty Materials.
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Physical Properties	Metric	English	Comments

Density	7.31 g/cc	0.264 lb/in³

Mechanical Properties	Metric	English	Comments
Tensile Strength, Ultimate	17.2 MPa	2500 psi

Thermal Properties	Metric	English	Comments
CTE, linear	29.0 µm/m-°C @Temperature 20.0 °C	16.1 µin/in-°F @Temperature 68.0 °F
Melting Point	156.7 °C	314.1 °F
Solidus	156.7 °C	314.1 °F
Liquidus	156.7 °C	314.1 °F

Component Elements Properties	Metric	English	Comments
Indium, In	100 %	100 %

Descriptive Properties
Creep Resistance	Poor

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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NAIMSP15 / 14596

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