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Master Bond adhesives

Silver-Copper Eutectic Alloy (72Ag-28Cu; UNS P07720; AWS BAg-8), Cold Drawn then Annealed at 350°C (660°F)
Categories: Metal; Nonferrous Metal; Precious Metal; Silver Alloy; Solder/Braze Alloy

Material Notes: Applications include brazing; the silver content promotes corrosion resistance.

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Physical PropertiesMetricEnglishComments
Density 10.1 g/cc0.365 lb/in³Calculated from pure elements
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 355 MPa51500 psi
Elongation at Break 11 %11 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000190 ohm-cm0.00000190 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Melting Point 779 °C1430 °F
Solidus 779 °C1430 °FEutectic
Liquidus 779 °C1430 °FEutectic
 
Processing PropertiesMetricEnglishComments
Processing Temperature 779 - 899 °C1430 - 1650 °FBrazing Range
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 28 %28 %
Other, total 0.15 %0.15 %to meet AWS BAg-8
Silver, Ag 72 %72 %

References for this datasheet.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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MPAgC1 / 12507

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