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solder replacement adhesives

Pb47-Sn39.93-Bi12.6 Lead-Tin-Bismuth Solder (UNS L54910)
Categories: Metal; Nonferrous Metal; Lead Alloy; Solder/Braze Alloy

Material Notes: For specialized, low temperature solder applications.

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Physical PropertiesMetricEnglishComments
Specific Gravity 9.53 g/cc9.53 g/ccCalculated
 
Thermal PropertiesMetricEnglishComments
Melting Point 146 - 176 °C295 - 349 °F
Solidus 146 °C295 °F
Liquidus 176 °C349 °F
 
Component Elements PropertiesMetricEnglishComments
Bismuth, Bi 12.6 %12.6 %
Lead, Pb 47.47 %47.47 %
Tin, Sn 39.93 %39.93 %

References for this datasheet.

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MLBIS949 / 135563

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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