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Master Bond adhesives

Germanium, Ge
Categories: Metal; Nonferrous Metal; Other Engineering Material; Semiconductor; Pure Element

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Physical PropertiesMetricEnglishComments
Density 5.3234 g/cc0.19232 lb/in³
a Lattice Constant 5.65754 Å5.65754 Å
Volume Compressibility, 10^-10 m²/N 0.7680.768
 
Chemical PropertiesMetricEnglishComments
Atomic Mass 72.6172.611995
Atomic Number 3232
Thermal Neutron Cross Section 2.5 barns/atom2.5 barns/atom
X-ray Absorption Edge 1.116 Å1.116 ÅK
 8.729 Å8.729 ÅLI
 9.9646 Å9.9646 ÅLII
 10.2277 Å10.2277 ÅLIII
Electronegativity 2.012.01Pauling
Ionic Radius 0.530 Å0.530 ÅCrystal Ionic Radius for Valence +4
 0.730 Å0.730 ÅCrystal Ionic Radius for Valence +2
 2.72 Å2.72 ÅCrystal Ionic Radius for Valence -4
 
Mechanical PropertiesMetricEnglishComments
Knoop Microhardness 76447644N/mm² Microhardness
Modulus of Elasticity 130 GPa18900 ksiAverage of three axes
Poissons Ratio 0.300.30Calculated
Shear Modulus 50.0 GPa7250 ksiAverage of three axes.
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000500 ohm-cm0.0000500 ohm-cm
Magnetic Susceptibility -1.20e-7-1.20e-7Atomic (cgs)
Critical Superconducting Temperature 5.35 K5.35 Kat 11.5 GPa pressure.
Dielectric Constant 1616
Band Gap 0.67 eV0.67 eV
Electron Mobility, cm²/V-s 38003800
Hole Mobility, cm²/V-s 18201820
 
Thermal PropertiesMetricEnglishComments
Heat of Fusion 478 J/g206 BTU/lb
Heat of Vaporization 3345 J/g1439 BTU/lb
CTE, linear 6.10 µm/m-°C
@Temperature 20.0 °C
3.39 µin/in-°F
@Temperature 68.0 °F
Specific Heat Capacity 0.3219 J/g-°C0.07694 BTU/lb-°F
Thermal Conductivity 64.0 W/m-K444 BTU-in/hr-ft²-°F
Melting Point 937.4 °C1719 °F
Boiling Point 2833 °C5131 °F
Heat of Formation 291 kJ/mol291 kJ/mol
Debye Temperature 101 °C214 °F
 
Optical PropertiesMetricEnglishComments
Refractive Index 3.993.99
 
Component Elements PropertiesMetricEnglishComments
Germanium, Ge 100 %100 %
 
Descriptive Properties
CAS Number7440-56-4
Crystal StructureCubicDiamond Structure - Space Group Fd3m

References for this datasheet.

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