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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® TV1002 Polyimide Adhesive
Categories: Polymer; Adhesive; Thermoset; Polymethacrylimide

Material Notes: Material Description: A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400ºC seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits.

Information Provided by Epoxy Technology

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.22 g/cc1.22 g/cc
Particle Size <= 10 µm<= 10 µm
Viscosity 350000 - 550000 cP
@Temperature 23.0 °C
350000 - 550000 cP
@Temperature 73.4 °F
0.5 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 107 ppm107 ppm
Ionic Impurities - K (Potassium) 2.0 ppm2.0 ppm
Ionic Impurities - Cl (Chloride) 50 ppm50 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Tensile Modulus 7.79 GPa1130 ksiStorage
 
Thermal PropertiesMetricEnglishComments
CTE, linear 46.0 µm/m-°C25.6 µin/in-°FBelow Tg
 139 µm/m-°C77.2 µin/in-°FAbove Tg
Thermal Conductivity 0.760 W/m-K5.27 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 300 °C572 °FContinuous
 400 °C752 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 200 °C>= 392 °FCure 150ºC/1 hour + 275ºC/1 hours; Ramp 20°C/min to 350ºC
Decomposition Temperature 519 °C966 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time 60.0 min
@Temperature 150 °C
1.00 hour
@Temperature 302 °F
+ 275°C, Minimum, Pre-Bake
Shelf Life 12.0 Month
@Temperature 25.0 °C
12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorBlack
ConsistencySmooth paste
Die Shear3.8 kg
Ionic Impurities NH427 ppm
Number of ComponentsSingle
Thixotropic Index>1.3between 0.5 & 1 rpm
Weight Loss0.22%200°C
 0.23%250°C
 0.29%300°C

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Chemically Resistant adhesives

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