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Chemically Resistant adhesives

Cosmic Plastics E4930 Mineral & Glass Filled Epoxy Molding Compound, Encapsulated Grade  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes:

Data provided by the manufacturer.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 2.00 g/cc0.0723 lb/in³
Apparent Bulk Density 0.800 g/cc0.0289 lb/in³
Water Absorption 0.25 %0.25 %48 hrs, 50°C
Linear Mold Shrinkage 0.0010 - 0.0040 cm/cm0.0010 - 0.0040 in/intypical.
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6565
Tensile Strength, Ultimate 83.0 MPa12000 psi
Flexural Strength 103 MPa14900 psi
Flexural Modulus 14.0 GPa2030 ksi
Compressive Strength 193 MPa28000 psi
Izod Impact, Notched 0.320 J/cm0.599 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm1.00e+15 ohm
Dielectric Constant  4.2
@Frequency 1000 Hz
4.2
@Frequency 1000 Hz
Wet
 4.5
@Frequency 1e+6 Hz
4.5
@Frequency 1e+6 Hz
Wet
Dielectric Strength 14.0 kV/mm356 kV/inWet, Step by Step
Dissipation Factor  0.011
@Frequency 1e+6 Hz
0.011
@Frequency 1e+6 Hz
Wet
 0.012
@Frequency 1000 Hz
0.012
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 25.0 µm/m-°C
@Temperature 20.0 °C
13.9 µin/in-°F
@Temperature 68.0 °F
Alpha 1
CTE, linear, Transverse to Flow 80.0 µm/m-°C
@Temperature 20.0 °C
44.4 µin/in-°F
@Temperature 68.0 °F
Alpha 2
Thermal Conductivity 1.2561 W/m-K8.7173 BTU-in/hr-ft²-°F
Deflection Temperature at 1.8 MPa (264 psi) >= 200 °C>= 392 °F
Glass Transition Temp, Tg 165 °C329 °F
 
Processing PropertiesMetricEnglishComments
Processing Temperature 150 - 175 °C302 - 347 °FMolding temperature

**
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PAESCW / 22955

Chemically Resistant adhesives

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