Hexcel® Redux® 319 High Performance Modified Epoxy Film Adhesive (0.07 psf)

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Hexcel® Redux® 319 High Performance Modified Epoxy Film Adhesive (0.07 psf)
Categories:	Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Redux 319 is a high performance modified epoxy film adhesive curing at 350°F. It is available in both supported and unsupported versions at areal weights between 0.03 and 0.08 psf. The supported versions contain a woven nylon carrier for glueline thickness control and improved handleability. Redux 319 is a hot melt film which is free from solvents and consequently it has a very low volatile content. Features: Cures in 60 min at 350°F; Good performance at temperatures ranging from -67°F to 300°F; Good short-term exposure performance at 350°F; Excellent peel properties; Good drape at ambient temperatures; Less than 1% volatile content. Applications: Aluminum to aluminum bonding; Fiber-reinforced composite to composite bonding; Aluminum honeycomb sandwich bonding; Aramid honeycomb sandwich bonding.
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Mechanical Properties	Metric	English	Comments

Tensile Strength, Yield	8.89 MPa @Temperature 22.2 °C	1290 psi @Temperature 72.0 °F	Flatwise Tensile
	9.294 MPa @Temperature 22.2 °C	1348 psi @Temperature 72.0 °F	Flatwise Tensile, Primed with Redux 119
Shear Strength	26.0 MPa @Temperature 149 °C	3770 psi @Temperature 300 °F	Lap Shear, Primed with Redux 119
	44.99 MPa @Temperature 22.2 °C	6525 psi @Temperature 72.0 °F	Lap Shear, Primed with Redux 119
Peel Strength	7.01 kN/m @Temperature 22.2 °C	40.0 pli @Temperature 72.0 °F	Bell Peel
	7.36 kN/m @Temperature 22.2 °C	42.0 pli @Temperature 72.0 °F	Bell Peel, Primed with Redux 119

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties
Areal Weight (psf)	0.07
Climbing Drum Peel (in-lb/3in)	134.6		72°F
	139.1		Primed with Redux 119; 72°F
Standard Roll (ft2)	430
Support	None

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