CEN® Electronic Material CN Polyimide Film, 4 Mil Thickness

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CEN® Electronic Material CN Polyimide Film, 4 Mil Thickness
Categories:	Polymer; Film; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	CEN®CN polyimide film is typical general-purpose polyimide film and has been used successfully in applications at temperatures as low as -269°C (-452°F) and as high as 400°C (752°F). CN film can be laminated, metallized, punched, formed or adhesive coated. CEN®CN is used for applications that require an all-polyimide film with an excellent balance of properties over a wide range of temperatures. Applications: mechanical parts, electronic parts, electrical insulation, pressure sensitive tape, fiber optics cable, insulation blankets, insulation tubing, automotive diaphragms sensors and manifolds. All information provided by CEN Electronic Material Co., LTD.
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Physical Properties	Metric	English	Comments

Thickness	94.0 - 106 microns	3.70 - 4.17 mil

Mechanical Properties	Metric	English	Comments
Film Tensile Strength at Yield, MD	135 MPa	19600 psi
Film Tensile Strength at Yield, TD	125 MPa	18100 psi
Film Elongation at Yield, MD	>= 45 %	>= 45 %
Film Elongation at Yield, TD	>= 45 %	>= 45 %

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm
Surface Resistance	>= 1.00e+14 ohm	>= 1.00e+14 ohm
Dielectric Strength	>= 140 kV/mm	>= 3560 kV/in

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PCENE019 / 93481

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